Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study
This paper describes newly defined eutectic SnAg solder bumping process using an alloy electroplating method and the interface reactions between four different types of UBM (under bump metallurgy) layers and eutectic SnAg bumps. In addition, the bumping process and UBM reactions of eutectic SnAg were compared with those of eutectic PbSn which is most commonly used as a solder bumping material.
- Publisher
- SPRINGER-VERLAG
- Issue Date
- 2002-01
- Language
- English
- Article Type
- Article; Proceedings Paper
- Keywords
INTERFACIAL REACTIONS; EUTECTIC SNPB; SOLDERS; METALLIZATION
- Citation
MICROSYSTEM TECHNOLOGIES, v.7, no.5-6, pp.269 - 272
- ISSN
- 0946-7076
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
This item is cited by other documents in WoS
| ⊙ Detail Information in WoSⓡ | Click to see |  |
| ⊙ Cited 3 items in WoS | Click to see citing articles in |  |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.