Filament-to-filament Joining Of Multi-filamentary Superconducting Tapes

Abstract

Ag/Bi-2223 tape with 9 filaments, which were arranged checkerwise, was successfully fabricated by using square drawing dies. Filament-to-filament superconductive joint between multi-filamentary Ag/Bi-2223 tapes has been fabricated by using a combination of chemical, mechanical and thermal techniques. The joined area, fabricated with a load of 2 ton, showed > 75% current carrying capacity of the tapes without joint-interface. Incomplete etching of silver sheath resulted in degradation of Ic at the joined area.