Filament-to-filament Joining Of Multi-filamentary Superconducting Tapes

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dc.contributor.authorLee, Hee Gyounko
dc.contributor.authorKuk, Il Hyunko
dc.contributor.authorHong, Gye Wonko
dc.contributor.authorKim, Eon Ako
dc.contributor.authorNo, Kwangsooko
dc.contributor.authorGoldacker, Wilfriedko
dc.date.accessioned2013-02-28T02:23:35Z-
dc.date.available2013-02-28T02:23:35Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1996-03-
dc.identifier.citationPHYSICA C: SUPERCONDUCTIVITY, v.259, no.1-2, pp.69 - 74-
dc.identifier.issn0167-2789-
dc.identifier.urihttp://hdl.handle.net/10203/72269-
dc.description.abstractAg/Bi-2223 tape with 9 filaments, which were arranged checkerwise, was successfully fabricated by using square drawing dies. Filament-to-filament superconductive joint between multi-filamentary Ag/Bi-2223 tapes has been fabricated by using a combination of chemical, mechanical and thermal techniques. The joined area, fabricated with a load of 2 ton, showed > 75% current carrying capacity of the tapes without joint-interface. Incomplete etching of silver sheath resulted in degradation of Ic at the joined area.-
dc.languageEnglish-
dc.publisherElsevier Science Bv-
dc.titleFilament-to-filament Joining Of Multi-filamentary Superconducting Tapes-
dc.typeArticle-
dc.identifier.scopusid2-s2.0-0030108120-
dc.type.rimsART-
dc.citation.volume259-
dc.citation.issue1-2-
dc.citation.beginningpage69-
dc.citation.endingpage74-
dc.citation.publicationnamePHYSICA C: SUPERCONDUCTIVITY-
dc.contributor.localauthorNo, Kwangsoo-
dc.contributor.nonIdAuthorLee, Hee Gyoun-
dc.contributor.nonIdAuthorKuk, Il Hyun-
dc.contributor.nonIdAuthorHong, Gye Won-
dc.contributor.nonIdAuthorKim, Eon A-
dc.contributor.nonIdAuthorGoldacker, Wilfried-
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