DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Hee Gyoun | ko |
dc.contributor.author | Kuk, Il Hyun | ko |
dc.contributor.author | Hong, Gye Won | ko |
dc.contributor.author | Kim, Eon A | ko |
dc.contributor.author | No, Kwangsoo | ko |
dc.contributor.author | Goldacker, Wilfried | ko |
dc.date.accessioned | 2013-02-28T02:23:35Z | - |
dc.date.available | 2013-02-28T02:23:35Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1996-03 | - |
dc.identifier.citation | PHYSICA C: SUPERCONDUCTIVITY, v.259, no.1-2, pp.69 - 74 | - |
dc.identifier.issn | 0167-2789 | - |
dc.identifier.uri | http://hdl.handle.net/10203/72269 | - |
dc.description.abstract | Ag/Bi-2223 tape with 9 filaments, which were arranged checkerwise, was successfully fabricated by using square drawing dies. Filament-to-filament superconductive joint between multi-filamentary Ag/Bi-2223 tapes has been fabricated by using a combination of chemical, mechanical and thermal techniques. The joined area, fabricated with a load of 2 ton, showed > 75% current carrying capacity of the tapes without joint-interface. Incomplete etching of silver sheath resulted in degradation of Ic at the joined area. | - |
dc.language | English | - |
dc.publisher | Elsevier Science Bv | - |
dc.title | Filament-to-filament Joining Of Multi-filamentary Superconducting Tapes | - |
dc.type | Article | - |
dc.identifier.scopusid | 2-s2.0-0030108120 | - |
dc.type.rims | ART | - |
dc.citation.volume | 259 | - |
dc.citation.issue | 1-2 | - |
dc.citation.beginningpage | 69 | - |
dc.citation.endingpage | 74 | - |
dc.citation.publicationname | PHYSICA C: SUPERCONDUCTIVITY | - |
dc.contributor.localauthor | No, Kwangsoo | - |
dc.contributor.nonIdAuthor | Lee, Hee Gyoun | - |
dc.contributor.nonIdAuthor | Kuk, Il Hyun | - |
dc.contributor.nonIdAuthor | Hong, Gye Won | - |
dc.contributor.nonIdAuthor | Kim, Eon A | - |
dc.contributor.nonIdAuthor | Goldacker, Wilfried | - |
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