Browse "College of Engineering(공과대학)" by Type Article
Showing results 51181 to 51240 of 62422
| Three-dimensional surface profile measurement using a beam scanning chromatic confocal microscope Chun, Byung Seon; Kim, Kwangsoo; Gweon, Dae-Gab, REVIEW OF SCIENTIFIC INSTRUMENTS, v.80, no.7, 2009-07 |
| Three-dimensional temperature distribution in laser surface hardening processes Woo, HG; Cho, Hyungsuck, PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, v.213, no.7, pp.695 - 712, 1999 |
| Three-dimensional textures and defects of soft material layering revealed by thermal sublimation Yoon, Dong Ki; Kim, Yun Ho; Kim, Dae Seok; Oh, Seong Dae; Smalyukh, Ivan I.; Clark, Noel A.; Jung, Hee-Tae, PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, v.110, no.48, pp.19263 - 19267, 2013-11 |
| Three-dimensional thermal simulation of nanosecond laser ablation for semitransparent material Ahn, Junsu; Na, Suck-Joo, APPLIED SURFACE SCIENCE, v.283, pp.115 - 127, 2013-10 |
| Three-dimensional thermo-elastic-plastic finite element modeling of quenching process of plain-carbon steel in couple with phase transformation Kang, Seong-Hoon; Im, Yong-Taek, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.49, no.4, pp.423 - 439, 2007-04 |
| Three-dimensional thermo-viscoplastic analysis of compression molding of sheet molding compounds with fiber volume fraction prediction Kim, SY; Im, Yong-Taek, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.63, no.1-3, pp.631 - 636, 1997-01 |
| Three-dimensional tomographically reconstructed optical emission profiles of Hall thruster plasmas Kim, Jinwoo; Lee, Dongho; Doh, Guentae; Park, Sanghoo; Kim, Holak; Choe, Wonho, PLASMA SOURCES SCIENCE & TECHNOLOGY, v.31, no.1, 2022-01 |
| Three-dimensional topological sweep for computing rotational swept volumes of polyhedral objects Baek, N; Shin, Sung-Yong; Chwa, Kyung Yong, INTERNATIONAL JOURNAL OF COMPUTATIONAL GEOMETRY APPLICATIONS, v.10, no.2, pp.131 - 156, 2000-04 |
| Three-Dimensional Trajectory Optimization of Soft Lunar Landings from the Parking Orbit with Considerations of the Landing Site Park, Bong-Gyun; Tahk, Min-Jea, INTERNATIONAL JOURNAL OF CONTROL AUTOMATION AND SYSTEMS, v.9, no.6, pp.1164 - 1172, 2011-12 |
| Three-Dimensional Unstructured Grid Euler Method Applied to Turbine Blades Kwon, Oh Joon, COMPUTATIONAL FLUID DYNAMICS JOURNAL, v.4, no.2, pp.165 - 176, 1995-07 |
| Three-dimensional variable-node elements based upon CS-FEM for elastic-plastic analysis Lee, Kyehyung; Son, Youngtak; Im, Seyoung, COMPUTERS STRUCTURES, v.158, pp.308 - 332, 2015-10 |
| Three-dimensional visual mapping of underwater ship hull surface using image stitching geometry Hong, Seonghun; Kim, Jinwhan, OCEAN ENGINEERING, v.269, 2023-02 |
| Three-dimensional Visual Mapping of Underwater Ship Hull Surface Using Piecewise-planar SLAM Hong, Seonghun; Kim, Jinwhan, INTERNATIONAL JOURNAL OF CONTROL AUTOMATION AND SYSTEMS, v.18, no.3, pp.564 - 574, 2020-03 |
| Three-dimensional visualization of choroidal vessels by using standard and ultra-high resolution scattering optical coherence angiography Hong, Y; Makita, S; Yamanari, M; Miura, M; Kim, Soohyun; Yatagai, T; Yasuno, Y, OPTICS EXPRESS, v.15, pp.7538 - 7550, 2007-06 |
| Three-Dimensional Vortex Flow past a Tilting Disc Valve using a Segregated Finite Element Scheme E. B. Shim; Chang, Keun Sick, COMPUTATIONAL FLUID DYNAMICS JOURNAL, v.3, no.1, pp.205 - 222, 1994 |
Three-dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids Park, Yoonseok; Franz, Colin K.; Ryu, Hanjun; Luan, Haiwen; Cotton, Kristen Y.; Kim, Jong Uk; Chung, Ted S.; et al, SCIENCE ADVANCES, v.7, no.12, 2021-03 |
| Three-Dimensional, Submicron Porous Electrode with a Density Gradient to Enhance Charge Carrier Transport Hyun, Gayea; Cao, Shengkai; Ham, Youngjin; Youn, Doo-Young; Kim, Il-Doo; Chen, Xiaodong; Jeon, Seokwoo, ACS NANO, v.16, no.6, pp.9762 - 9771, 2022-06 |
| Three-dimensionally crossing manifold micro-mixer for fast mixing in a short channel length Lim, Tae-Woo; Son, Yong; Jeong, Yu-Jin; Yang, Dong-Yol; Kong, Hong-Jin; Lee, Kwang-Sup; Kim, Dong-Pyo, LAB ON A CHIP, v.11, no.1, pp.100 - 103, 2011-01 |
| Three-dimensionally patterned Ag-Pt alloy catalyst on planar Si photocathodes for photoelectrochemical H-2 evolution Lim, Sung Yul; Ha, Kyungyeon; Ha, Heonhak; Lee, Soo Youn; Jang, Min Seok; Choi, Mansoo; Chung, Taek Dong, PHYSICAL CHEMISTRY CHEMICAL PHYSICS, v.21, no.8, pp.4184 - 4192, 2019-01 |
| Three-dimensionally printed cellular architecture materials: perspectives on fabrication, material advances, and applications Kaur, Manpreet; Han, Seung Min; Kim, Woo Soo, MRS COMMUNICATIONS, v.7, no.1, pp.8 - 19, 2017-03 |
| Three-Dimensionally Printed Polylactic Acid as Solid Fuel for Hydrogen Peroxide Hybrid Rockets Ahn, Byeonguk; Huh, Jeongmoo; Bhosale, Vikas Khandu; Kwon, Sejin, JOURNAL OF PROPULSION AND POWER, v.37, no.1, pp.171 - 175, 2021-01 |
| Three-dimensionally reconfigurable focusing of laser by mechanically tunable metalens doublet with built-in holograms for alignment Jung, Joonkyo; Kim, Hyeonhee; Shin, Jonghwa, NANOPHOTONICS, v.12, no.8, pp.1373 - 1385, 2023-04 |
| Three-Electrode Metal-Oxide Gas Sensor System With CMOS Interface IC Park, Jeong Ho; Park, Kwang Min; Kim, Tae-Wan; Shin, Seongheon; Park, Chong-Ook; Yoo, Hyung-Joun, IEEE SENSORS JOURNAL, v.17, no.3, pp.784 - 793, 2017-02 |
| Three-Level Capacitor Clamping Single Sustaining Driver With Dual Energy Recovery Path for Low Cost AC Plasma Display Panel Choi, SW; Moon, GunWoo, JOURNAL OF DISPLAY TECHNOLOGY, v.5, pp.398 - 407, 2009-10 |
| Three-level differential buffer for increasing noise margin in pseudo-differential signalling Ha, K. -S.; Kim, Lee-Sup; Bae, S. -J.; Park, K. -I.; Choi, J. S.; Jun, Y. -H., ELECTRONICS LETTERS, v.46, no.21, pp.1429 - 1430, 2010-10 |
| Three-Level Resonant Converter With Double Resonant Tanks for High-Input-Voltage Applications Lee, Il-Oun; Cho, Shin-young; Moon, Gun-Woo, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.59, no.9, pp.3450 - 3463, 2012-09 |
| Three-machine flow shop scheduling with overlapping waiting time constraints Kim, Hyunjung; Lee, Jun-Ho, COMPUTERS & OPERATIONS RESEARCH, v.101, pp.93 - 102, 2019-01 |
| Three-point recognition and selective fluorescence sensing of L-DOPA Coskun, Ali; Akkaya, EU, ORGANIC LETTERS, v.6, no.18, pp.3107 - 3109, 2004-09 |
| Three-stage clos-network switch architecture with buffered center stage for multi-class traffic Kang, MK; Kyung, Chong-Min, JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, v.15, pp.263 - 276, 2006-04 |
| Three-stage design of high-resolution microalgae-based biofuel supply chain using geographic information system Kang, Seongwhan; Heo, Seongmin; Realff, Matthew J.; Lee, Jay Hyung, APPLIED ENERGY, v.265, pp.114773, 2020-05 |
| Three-stage model for robust real-time face tracking Do, Jun-Hyeong; Bien, Zeung nam, INTERNATIONAL JOURNAL OF IMAGING SYSTEMS AND TECHNOLOGY, v.17, no.6, pp.321 - 327, 2007 |
| Three-STEP HEURISTIC ALGORITHM FOR OPTIMAL PLA COLUMN FOLDING YANG, YY; Kyung, Chong-Min, ELECTRONICS LETTERS, v.24, no.17, pp.1088 - 1090, 1988-08 |
| Three-STEP PIN ASSIGNMENT ALGORITHM FOR BUILDING BLOCK LAYOUT CHOI, SG; Kyung, Chong-Min, ELECTRONICS LETTERS, v.28, no.20, pp.1882 - 1884, 1992-09 |
| Three-Switch Active-Clamp Forward Converter With Low Switch Voltage Stress and Wide ZVS Range for High-Input-Voltage Applications Park, Ki-Bum; Kim, Chong-Eun; Moon, GunWoo; Youn, Myung Joong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.25, pp.889 - 898, 2010-04 |
| Three-terminal vertical ferroelectric synaptic barristor enabled by HZO/ graphene heterostructure with rebound depolarization Jang, Seonghoon; Kim, Yongjun; Jeon, Jihoon; Ham, Seonggil; Choi, Sanghyeon; Yang, Jehyeon; Kim, Seong Keun; et al, JOURNAL OF ALLOYS AND COMPOUNDS, v.965, 2023-11 |
| Three-transistor one-time programmable (OTP) ROM cell array using standard CMOS gate oxide antifuse Kim, J; Lee, Kwyro, IEEE ELECTRON DEVICE LETTERS, v.24, pp.589 - 591, 2003-09 |
| Three-way junction-induced isothermal amplification for nucleic acid detection Lee, Seoyoung; Jang, Hyowon; Kim, Hyo Yong; Park, Hyun Gyu, BIOSENSORS & BIOELECTRONICS, v.147, pp.111762, 2020-01 |
| THRESHOLD BOOLEAN FILTERS LEE, KD; Lee, Yong-Hoon, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.42, no.8, pp.2022 - 2036, 1994-08 |
| Threshold Modulative Artificial GABAergic Nociceptor Kim, Geunyoung; Lee, Younghyun; Jeon, Jae Bum; Cheong, Woon Hyung; Park, Woojoon; Song, Hanchan; Kim, Kyung Min, ADVANCED MATERIALS, v.35, no.47, 2023-11 |
| Threshold Password-Based Authentication Using Bilinear Pairings Lee, Songwon; Yang, Jeongkyu; Kim, Kwangjo, CSS2003, pp.19-24, 2003-10 |
| Threshold password-based authentication using bilinear pairings Lee, Sangwon; Han, Kyusuk; Kang, Seok-kyu; Kim, Kwangjo; Ine, So Ran, PUBLIC KEY INFRASTRUCTURE, PROCEEDINGS BOOK SERIES: LECTURE NOTES IN COMPUTER SCIENCE, v.3093, pp.350 - 363, 2004 |
| THRESHOLD SELECTION ALGORITHM FOR EXTRACTING A UNIFORM COLOR REGION IN AN IMAGE CHANG, BH; Kim, Seong-Dae; Kim, Jae Kyoon, ELECTRONICS LETTERS, v.23, no.25, pp.1362 - 1363, 1987-12 |
| Threshold Voltage Control of Multilayered MoS2 Field-Effect Transistors via Octadecyltrichlorosilane and their Applications to Active Matrixed Quantum Dot Displays Driven by Enhancement-Mode Logic Gates Roh, Jeongkyun; Ryu, Jae Hyeon; Baek, Geun Woo; Jung, Heeyoung; Seo, Seung Gi; An, Kunsik; Jeong, Byeong Guk; et al, SMALL, v.15, no.7, 2019-02 |
| Threshold Voltage Tuning Technique in Gate-All-Around MOSFETs by Utilizing Gate Electrode With Potential Distribution Park, Jun-Young; Bae, Hagyoul; Moon, Dong-Il; Jeon, Chang-Hoon; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.37, no.11, pp.1391 - 1394, 2016-11 |
| Threshold-based camera motion characterization of MPEG video Kim, JG; Chang, HS; Kim, J; Kim, Hyung-Myung, ETRI JOURNAL, v.26, pp.269 - 272, 2004-06 |
| Threshold-Based Random Charging Scheme for Decentralized PEV Charging Operation in a Smart Grid Kwon, Ojin; Kim, Pilkee; Yoon, Yong-Jin, SENSORS, v.17, no.1, 2017-01 |
| Throttle and preempt: A flow control policy for real-time traffic in wormhole networks Song, H; Kwon, B; Yoon, Hyunsoo, JOURNAL OF SYSTEMS ARCHITECTURE, v.45, no.8, pp.633 - 649, 1999-02 |
| Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01 |
| Through the Eyes of the User: Evaluating Neonatal Intensive Care Unit Design Denham, Megan E.; Bushehri, Yousef; Lim, Lisa, HERD-HEALTH ENVIRONMENTS RESEARCH & DESIGN JOURNAL, v.11, no.3, pp.49 - 65, 2018-07 |
| Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Through-thickness compressive strength of a carbon/epoxy composite laminate Kim, Byung Chul; Park, Dong Chang; Kim, Byoung Jung; Lee, Dai Gil, COMPOSITE STRUCTURES, v.92, no.2, pp.480 - 487, 2010-01 |
| Through-thickness compressive strength of carbon-phenolic woven composites Park, DC; Lee, Dai Gil, COMPOSITE STRUCTURES, v.70, no.4, pp.403 - 412, 2005-10 |
| Throughput Analysis Considering Coupling Effect in IEEE 802.11 Networks with Hidden Stations Kim, Tae-Joon; Lim, Jong-Tae, IEEE COMMUNICATIONS LETTERS, v.13, pp.175 - 177, 2009-03 |
| THROUGHPUT ANALYSIS FOR 2 ARQ SCHEMES USING COMBINED TRANSITION MATRIX KIM, SR; Un, Chong-Kwan, IEEE TRANSACTIONS ON COMMUNICATIONS, v.40, no.11, pp.1679 - 1683, 1992-11 |
| THROUGHPUT ANALYSIS OF CHANNEL LOAD SENSE MULTIPLE ACCESS WITH OVERLOAD DETECTION PROTOCOL IN SPREAD SPECTRUM PACKET RADIO NETWORKS LIM, DM; Lee, Hwang Soo, ELECTRONICS LETTERS, v.27, no.20, pp.1809 - 1810, 1991-09 |
| Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism Lee, IG; Yoo, Hyung Joun; Park, Sin Chong, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E88B, no.1, pp.402 - 407, 2005-01 |
| Throughput and Delay Performance of DSL Broadband Access with Cross-Layer Dynamic Spectrum Management Tsiaflakis, Paschalis; Yi, Yung; Chiang, Mung; Moonen, Marc, IEEE TRANSACTIONS ON COMMUNICATIONS, v.60, no.9, pp.2700 - 2711, 2012-09 |
| Throughput Characteristics by Multiuser Diversity in a Cognitive Radio System Hong, Jun-Pyo; Choi, Wan, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.59, no.8, pp.3749 - 3763, 2011-08 |
| Throughput Efficiency of LAPB/D Protocol with Multi-Reject Error Recovery Procedure W.Y.Jung; C.K.Un, ELECTRONICS LETTERS, v.25, no.19, pp.1318 - 1320, 1989-09 |
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