Browse "ME-Conference Papers(학술회의논문)" by Author Kim, Taek-Soo
Showing results 64 to 123 of 134
| High-Efficiency, Stable, Green-Solvent Processed Single-Component Organic Solar Cells Enables by Benzodithiophene-Based Conjugated Block Copolymer Phan, Tan Ngoc Lan; Lee, Jin-Woo; Oh, Eun Sung; Lee, Seungjin; Kim, Taek-Soo; Kim, Bumjoon J., Polyconcensation 2022, The Polymer Society of Korea, 2022-09-18 |
| High-performance organic solar cells enabled by sequentially fluorinated polythiophene donors Lee, Heung Goo; Lee, Jin-Woo; Oh, Eunsung; Lee, Sun Woo; Phan, Tan Ngoc-Lan; Li, Sheng; Kim, Taek-Soo; et al, Global Photovoltaic Conference, GPVC 2023, Korea Photovoltaic Society (KPVS), 2023-09-08 |
| Hydrogel-laden Paper Scaffolds for Origami-based Tissue Engineering Yu, Seung Jung; Kim, Suwhan; 이학래; Kim, Taek-Soo; 권성근; 황석연; Im, Sung Gap, 2015 MRS Fall Meeting & Exhibit, MRS(Materials Research Society), 2015-12-01 |
| Improving Defect Healing in Graphene by Enhanced Selective Electrochemical Deposition Cho, Minsun; Kang, Sumin; Kim, Taek-Soo, 2018 - Emerging Technologies in Mechanical Engineering, The Korean Society of Mechanical Engineers (KSME), 2018-08-21 |
| Interfacial adhesion and diffusion barrier characteristics of graphene layer Yoon, Taeshik; Kim, Taek-Soo, 67th IIW International Conference, IIW, 2014-07-17 |
| Interfacial adhesion and diffusion barrier characteristics of synthesized graphene Yoon, Taeshik; Cho, Byung Jin; Kim, Taek-Soo, 2014 The World Conference on Carbon, Carbon, 2014-07-03 |
| Intrinsically Stretchable, Green Solvent-Processed, and Efficient Polymer Solar Cells Enabled by Hydrophilic Flexible Spacer-Incorporating Polymer Donors Lim, Chulhee; Lee, Jin-Woo; Lee, Sun-Woo; Jeon, Yeonji; Kim, Taek-Soo; Lee, Jung-Yong; Kim, Bumjoon J., Polyconcensation 2022, The Polymer Society of Korea, 2022-09-18 |
| INTRINSICALLY-STRETCHABLE AND NON-HALOGENATED SOLVENT PROCESSED POLYMER SOLAR CELLS ENABLED BY HYDROPHILIC FLEXIBLE SPACER-INCORPORATING POLYMERS Lim, Chulhee; Lee, Jin-Woo; Lee, Sun Woo; Jeon, Yeonji; Lee, Seungjin; Kim, Taek-Soo; Lee, Jung-Yong; et al, 2023 MRS Spring Meeting & Exhibit, Materials Research Society (MRS), 2023-04-10 |
| Investigation on the Mechanical Reliability of TiN/SiO2 for W Nucleation Processes Lee, Sun Woo; Kim, Dong Jun; Jeon, Jinho; Yun, WonJun; Kim, Tae-Sung; Kim, Taek-Soo, The 19th International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2021-11-05 |
| Joining Technology and Joint Reliability between Flexible Substrate and Si Chip with Micro-bump Ko, Yong Ho; Kim, Taek-Soo; Bang, Jung-Hwan; Lee, Chang-Woo, 67th IIW International Conference, IIW, 2014-07-17 |
| Measurement of Adhesion and Mechanical Properties of Thin Films Kim, Taek-Soo, The Korean Microelectronics and Packaging Society 2015 Spring Meeting, 한국 마이크로 전자 및 패키징 학회, 2015-04-02 |
| Measurement of Equivalent Modulus of Chip Package Using Bending Test Kim, Hyeongjun; Lee, Tae-Ik; Park, Chun Myung; Park, Chang Kyu; Kim, Taek-Soo, The 17th International Symposium on Microelectronics and Packaging (ISMP2018), The Korean Microelectronics and Packaging Society, 2018-10-25 |
| Measurement of Mechanical Behavior of Pristine Fuel Cell Electrodes Using Water Surface Kim, Sanwi; Kim, Jae Han; Oh, Jong-Gil; Jang, Kyung-Lim; Jeong, Byeong-Heon; Hong, Bo Ki; Kim, Taek-Soo, 232nd ECS Meeting, The Electrochemical Society, 2017-10-04 |
| Measurement of Mechanical Properties of Advanced Ultra-Thin Films using Water surface Platform Kim, JH; Jang, KR; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-15 |
| Mechanical Behavior of Transparent Conducting Oxide Thin Films for Advanced Electronic Applications Oh, Seung Jin; Kwon, Jeong Hyun; Lee, Sangmin; Kim, Taek-Soo, ICEM20 - 20th International Conference on Experimental Mechanics, EuraSEM - European Society of Experimental Mechanics, 2023-07-06 |
| Mechanical Properties of Advanced Thin Films for Energy Applications Kim, Taek-Soo, European Materials Research Society (E-MRS) Spring Meeting, European Materials Research Society, 2019-05-28 |
| Mechanical Properties of TEOS Thin Film Kim, Hyeong Jun; Kim, Dong Jun; Kim, Taek-Soo, ICEM20 - 20th International Conference on Experimental Mechanics, EuraSEM - European Society of Experimental Mechanics, 2023-07-06 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, JSME-CMD International Computational Mechanics Symposium, JSME-CMD, 2012-10-11 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, 14th International Conference on Modern Materials and Technologies, The National Research Council of Italy, 2018-06-10 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, 대한금속재료학회 2015년 춘계학술대회, 대한금속재료학회, 2015-04-23 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC 2015), International Conference on Electronic Packaging, 2015-04-16 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, ENGE2014 Meeting, ENGE, 2014-11-16 |
| Mechanical Reliability of Cu/Low-k Interconnects and Underfill Yoon, Taeshik; Lee, Inhwa; Kim, Taek-Soo, IEEE International 3D System Integration Conference, IEEE, 2012-02-02 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill Kim, Taek-Soo, Korea-SV Electronics Packaging Technology Workshop, Korea-SV Electronics Packaging Technology Workshop, 2010-10-21 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill Kim, Taek-Soo, The 10th International Symposium on Microelectronics and Packaging, Korean Microelectronics and Packaging Society, 2011-10-12 |
| Mechanically Reliable Mechanism using Torsion Spring and Compliant Adhesive for Rollable Display Ma, Boo Soo; Kim, Taek-Soo, The 16th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2017-10-19 |
| Methodology Development of Warpage Analysis of Polymer Based Packaging Substrate Kim, Cheolgyu; Lee, Tae-ik; Choi, Hyesun; Kim, Min-Sung; Kim, Taek-Soo, 64th Electronic Components and Technology Conference, pp.1004 - 1009, Electronic Components and Technology Conference(ECTC), 2014-05-29 |
| Moisture-Assisted Interfacial Crack Growth of SOFC Jang, K.-R.; Yoon, K.J.; Son, J.-W.; Kim, Taek-Soo, The 13th International Nanotech Symposium & Nano-Convergence Expo Nano Korea 2015, Nano Korea, 2015-07-01 |
| Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films Kim, Taek-Soo; R.H. Dauskardt, Materials Research Society 2010 Spring Meeting, Materials Research Society, 2010-04-05 |
| Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films Kim, Taek-Soo; R.H. Dauskardt, 2010 NCCAVS CMPUG, NCCAVS CMPUG, 2010-04-28 |
| Non-Destructive Measurement of Graphene Defects using Induced Voltage Kang, Sumin; Yoon, Taeshik; KANG, TAE YEOB; Kim, Taek-Soo, Carbon 2017, Royal Australian Chemical Institute, 2017-07-24 |
| On-Chip Canary Circuit Design for Electronic Interconnects by Utilizing RF Resonance Peak Movement as a Prognostic Factor Kang, Tae Yeob; Seo, Donghwan; Kim, Taek-Soo, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08 |
| Optimization of Cu Interconnects - SiCN Interfacial Adhesion by Surface Treatments Kim, Dong Jun; Kang, Sumin; Lee, Sun Woo; Lee, Inhwa; Park, Seungju; Lee, Jun Soo; Lee, Jihyun; et al, The 19th International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2021-11-05 |
| Optimization of Cu interconnects - SiCN interfacial adhesion by surface treatments Kim, Dong Jun; Kang, Sumin; Lee, Sun Woo; Lee, Inhwa; Park, Seungju; Lee, Jihyun; Kim, Joong Jung; et al, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, pp.363 - 373, IEEE, 2023-05-31 |
| Optimization of Multilayer Inorganic/Organic Thin Film Structure for Foldable Barrier Films Shin, Jeong-Ha; Kim, Wansun; Choi, Gwang Mun; Kim, Taek-Soo; Bae, Byeong-Soo, SID 2017, Society for Information Display, 2017-05-24 |
| Optimized CMP for Device Structure Containing Ultra-Low-k Dielectrics Kim, Taek-Soo; R.H. Dauskardt, SEMICON Korea, SEMICON, 2009-01-20 |
| Optimized CMP of Nanomaterials Kim, Taek-Soo; R.H. Dauskardt, 215th Electrochemical Society Meeting, Electrochemical Society, 2009-05-24 |
| Optimizing CMP for Ultra-Low-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, 13th International Chemical Mechanical Planarization Conference for ULSI Multilevel Interconnection, 13th International Chemical Mechanical Planarization Conference for ULSI Multilevel Interconnection, 2008-01-01 |
| Porous Dielectric Elastomer Based Ultra-Sensitive Capacitive Pressure Sensor and Its Application to Wearable Sensing Device Kwon, Donguk; LEE, TAE-IK; Kim, M.S; Kim, S; Kim, Taek-Soo; Park, In-Kyu, 18th International Conference on Solid-State Sensors, Actuators and Microsystems transducers, Transducers, 2015-06-23 |
| Prediction of Wiggling Phenomenon in High Aspect Ratio Thin Film Structure During Etching Process through Buckling-Based Dimensional Analysis Song, Myoung; Jang, Kyung-Lim; Jung, Narae; Kim, Sungjin; Kim, Dae Sin; Kim, Taek-Soo, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Quantitative Roadmap for Optimizing CMP of Ultra-Low-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, IEEE International Interconnect Technology Conference , IEEE, 2008-06-01 |
| Quantitative Roadmap for Optimizing CMP of Ultralow-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14 |
| Research for Mechanical Reliability Improvement of Silver Nanoparticle Thin Films Lee, I; Kim, Taek-Soo, 2013 KSPE Fall Meeting, KSPE, 2013-10-30 |
| Research on the Adhesion Change of Graphene/Cu Interface by UV/Ozone Treatment Seo, J.; Chang, W.; Kim, Taek-Soo, NANO KOREA 2013 Symposium, NANO KOREA, 2013-07-10 |
| Reversible Self-Bending Soft Hydrogel by using pH Responsive Microbilayer with Mechanically Optimized Designs Kim, Cheolgyu; Kim, Jongmin; Song, YoungShin; Jeong, Seong-Geun; Lee, Chang-Soo; Kim, Taek-Soo, 2018 MRS Spring, Materials Research Society, 2018-04-06 |
| Solar-Rechargeable Wearable Textile Battery Choi, Jang Wook; Lee, Yong-Hee; Kim, Joo-Seong; Noh, Jong-Hyun; Kim, Taek-Soo; Lee, Jung-Yong, 2014 Materials Research Society Spring Meeting, Materials Research Society(MRS), 2014-04-21 |
| Strategies for Improving Mechanical Reliability of Thin Film Flexible Electronics Kim, Taek-Soo, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, The Japan Institute of Electronics Packaging, 2018-04-19 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, SEMICON KOREA 2018, Semiconductor Equipment and Materials International, 2018-02-01 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, IEEE International Flexible Electronics Technology Conference (IFETC), IEEE, 2019-08-13 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, 2019-10-24 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, International Meeting on Information Display, IMID 2021, The Korean Information Display Society (KIDS) & The Society for Information Display (SID), 2020-08-25 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, Advanced Epitaxy for Freestanding Membranes and 2D Materials Conference, AEFM 2023, AEFM, 2023-07-12 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, International Conference on Electronics Packaging (ICEP), The Japan Institute of Electronics Packaging, 2023-04-20 |
| Stress Analysis of Rollable OLED Display Considering Boundary Conditions Based on Finite Element Method Ma, Boo Soo; Kim, Taek-Soo, 2018 20th International Conference on Electronic Materials and Packaging (EMAP), IEEE, 2018-12-18 |
| Stress and Solution Chemistry Effects for Optimized CMP of Ultra-Low-k Dielectrics Kim, Taek-Soo; Zhong, Q; Peterson, M; Tam, H; Konno, T; Dauskardt, R.H., Materials Research Society 2008 Spring Meeting, Materials Research Society, 2008-03-24 |
| Study of Fracture and Tensile Properties of All-Polymer and Fullerene-Polymer Solar Cells Based on Same Polymer Donor Choi, Joonhyeong; Kim, Wansun; Kim, Jae Han; Kim, Taesu; Kim, Mingoo; Kim, Bumjoon J.; Kim, Taek-Soo, APS March Meeting 2018, Bulletin of the American Physical Society, 2018-03-07 |
| Tensile Properties of ALD Alumina without Substrate Measured by Tensile Testing on Water Surface Lee, Sangmin; Koo, Junmo; Kim, Junmo; Shim, Joon-Hyung; Kim, Taek-Soo, 2019 MRS Fall Meeting & Exhibit, Materials Research Society, 2019-12-02 |
| Tensile Testing of Ultra-Thin Films using Water Surface Kim, J; Nizami, A; Hwangbo, Y; Jang, B; Lee, H; Woo, C; Hyun, S; et al, 2013 KSPE Fall Meeting, KSPE, 2013-10-30 |
| Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films Lee, I.; Lee, J.; Ko, Seung Hwan; Kim, Taek-Soo, 15th International Conference on Electronic Materials and Packaging, Electronic Materials and Packaging (EMAP), 2013-10-06 |
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