MS-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 5141 to 5160 of 7245

5141
Electrical properties of BST thin films prepared by ECR-PEMOCVD

Lee, JS; Bae, JS; Song, HW; Jun, BH; No, Kwangsoo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.32, pp.1430 - 4, 1998-02

5142
리드프레임의 산화가 Cu/EMC 계면 접착력에 미치는 영향

백경욱; 조순진, 한국재료학회지, v.7, no.9, pp.781 - 788, 1997-09

5143
고집적 패키지 기술

백경욱, 한국통신학회논문지, v.13, no.11, pp.91 - 103, 1996-11

5144
이방성 전도 필름의 접촉저항, 접착력 및 신뢰성에 미치는 접속 변수의 영향

임명진; 백경욱, 한국재료학회지, v.8, no.5, pp.399 - 407, 1998-05

5145
기계적 합금화된 산화물 분산강화 니켈기 초내열 합금에서 초기 결정립 크기가 결정립 형상비에 미치는 영향

백경욱; 이정훈; 박이주; 김영길, 대한금속학회지, v.35, no.10, pp.1366 - 1374, 1997-10

5146
라미네이션 공정으로 제조된 멀티칩 모듈 기판에서의 열적-기계적 응력 해석

김진수; 백경욱; 오승환; 서현식, 대한금속학회지, v.36, no.1, pp.27 - 32, 1998-01

5147
Design and understanding of Anisotropic Conductive Films (ACFs) for LCD packaging

Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, v.21, no.2, pp.226 - 234, 1998-06

5148
마이크로 머신 (MEMS) 소자 패키지의 열응력에 대한 연구

백경욱; 전우석, 한국재료학회지, v.8, no.8, pp.744 - 750, 1998-08

5149
Relative humidity cycle testing on GE-HDI

Li, M; Wu, X; Pecht, M; Paik, Kyung-Wook; Bernard, E, INTERNATIONAL JOURNAL OF MICROELECTRONIC PACKAGING, v.1, no.1, pp.13 - 34, 1995-01

5150
Predicting SCC susceptibility of austenitic stainless steel by rapid scratching electrode technique

Yeom, KA; Cho, EA; Kwon, Hyuk-Sang; Kim, JJ, ELECTROCHEMICAL METHODS IN CORROSION RESEARCH VI, PTS 1 AND 2, v.289-2, pp.969 - 978, 1998

5151
DEGRADATION OF THIN-FILMS OF YBA2CU3O7 BY ANNEALING IN AIR AND IN VACUUM

Mogrocampero, A; Paik, Kyung-Wook; Turner, LG, JOURNAL OF SUPERCONDUCTIVITY, v.8, no.1, pp.95 - 98, 1995-02

5152
To cut or Not to cut: A Thermomechanical Stresss Analysis of Polyimide Thin Film on Ceramic Structures

Paik, Kyung-Wook; Pecht, Michael; Bhandarkar, S. Navin; Wu, Xin, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.18, no.1, pp.150 - 153, 1995-01

5153
Biaxial stress analysis in laminated polymer films on silicon substrates for MCM-D application

Kim, JS; Paik, Kyung-Wook; Seo, HS; Oh, SH, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.33, pp.142 - 147, 1998-11

5154
Chromium aluminum oxide films for ArF line high transmittance attenuated phase shifting mask application

Kim, E; Moon, SY; Kim, YH; Yoon, HS; No, Kwangsoo, OPTICAL ENGINEERING, v.39, no.11, pp.2947 - 2955, 2000-11

5155
Observation of domain nucleation and growth during switching process

Hong, Daniel Seungbum; Colla, EL; Kim, E; No, Kwangsoo; Taylor, DV; Tagantsev, AK; Muralt, P; et al, FERROELECTRICS, v.223, no.1-4, pp.143 - 143, 1999

5156
Pb(Zr,Ti)O-3 films fabrication by sol-gel method for piezoelectric actuated device

Kim, BJ; Lee, J; Yoo, JB; No, Kwangsoo, FERROELECTRICS, v.232, no.1-4, pp.1127 - 1132, 1999

5157
Reliability Enhancement of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates by Non-Conducting Filler Additions

백경욱; 임명진, 한국마이크로전자 및 패키징학회지, v.7, no.1, pp.41 - 49, 2000-01

5158
Flip Chip on Organic Board Technology using Modified Anisotropic Conductive Films and Electroless Nickel/Gold Bump

백경욱; 임명진; 전영두, 한국마이크로전자 및 패키징학회지, v.6, no.2, pp.13 - 21, 1999-06

5159
The effect of reduction ratio of hot rolling on texture and secondary recrystallization of MA 754 plate

Lee, JH; Park, LJ; Kim, SB; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE LETTERS, v.18, no.20, pp.1645 - 1648, 1999

5160
전해도금법을 이용한 공정 납-주석 플립 칩 솔더 범프와 UBM (Under Bump Metallurgy) 계면반응에 관한 연구

백경욱; 장세영, 한국재료학회지, v.9, no.3, pp.288 - 294, 1999-03

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