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Jung, Heechan; Lee, Sangwon; Kang, Taehyeok; Zargaran, Alireza; Choi, Pyuck-Pa; Sohn, Seok Su, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.181, pp.71 - 81, 2024-05
Pornnoppadol, Gahsidit; Cho, Soojeong; Yu, Jeong Heon; Kim, Shin-Hyun; Nam, Yoon Sung, MOLECULAR SYSTEMS DESIGN & ENGINEERING, v.9, no.5, pp.507 - 517, 2024-05
Lee, Jeong-A; Cho, Yoonhan; Kim, Saehun; Kweon, Seong Hyeon; Kang, Haneul; Byun, Jeong Hwan; Kwon, Eunji; Seo, Samuel; Ryu, Kyoung Han; Kim, Wonkeun; Kwak, Sang Kyu; Choi, Nam-Soon; HONG, DANIEL SEUNGBUM, ADVANCED SCIENCE, v.11, no.17, 2024-05
Oh, Jimin; Yeom, Jiwon; Madika, Benediktus; Kim, Kwang Man; Liow, Chi Hao; Agar, Joshua C; Hong, Seungbum, NPJ COMPUTATIONAL MATERIALS, v.10, no.1, 2024-05
Effects of the polymer residues on via contact resistance after reactive ion etching Ko, HS; Nah, JW; Paik, Kyung-Wook; Park, Y, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.20, no.3, pp.1000 - 1007, 2002 |
Highly reliable non-conductive adhesives for flip chip CSP applications Yim, MJ; Hwang, JS; Kwon, W; Jang, KW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.26, pp.150 - 155, 2003-04 |
A study on coining processes of solder bumps on organic substrates Nah, JW; Paik, Kyung-Wook; Hwang, TK; Kim, WH, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.26, pp.166 - 172, 2003-04 |
BaTiO3분말의 입자 크기가 내장형 커패시턴용 에폭시/BaTiO3 복합체 필름의 유전상수와 누설전류에 미치는 영향에 관한 연구 Paik, Kyung-Wook; 조성동; 이주연, 마이크로전자 및 패키징학회지, v.9, no.2, pp.11 - 17, 2002-06 |
Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study Jang, SY; Wolf, J; Ehrmann, O; Reichl, H; Paik, Kyung-Wook, MICROSYSTEM TECHNOLOGIES, v.7, no.5-6, pp.269 - 272, 2002-01 |
Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM) Jang, Se-Young; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.25, no.3, pp.193 - 202, 2002-07 |
Field emission characteristics of CoSi2/TiN-coated silicon emitter tips Han, BW; Lee, HS; Ahn, Byung Tae, APPLIED SURFACE SCIENCE, v.187, no.1-2, pp.45 - 50, 2002-02 |
Cu2Te 배면 전극을 이용한 p-type CdTe 태양전지의 ohmic contact 형성 및 CdTe 태양전지의 광전압 특성 Kim, Ki Hwan; Yun, Jae Ho; Lee, Doo Youl; Ahn, Byung Tae, 한국재료학회지, v.12, no.12, pp.918 - 923, 2002-12 |
운모기판을 이용한 다결정 Si 전이막 성장 연구 엄지혜; 안병태; 전영권; 박진우, 한국재료학회지, v.14, no.5, pp.343 - 347, 2004-05 |
유도결합 N2O 플라즈마를 이용한 실리콘 산화막의 저온성장과 다결정 실리콘 박막 트랜지스터에의 영향 원만호; 김상철; 안진형; 김보현; 안병태, 한국재료학회지, v.12, no.9, pp.724 - 728, 2002-09 |
반응성 CVD를 이용한 다결정 실리콘 기판에서의 CoSi2 layer의 성장거동과 열적 안정성에 관한 연구 김선일; 이희승; 박종호; 안병태, 한국재료학회지, v.13, no.1, pp.1 - 5, 2003-01 |
Enhanced crystallization of amorphous Si using viscous Ni solution and microwave annealing Ahn, JH; Eom, JH; Ahn, Byung Tae, JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, v.2, no.2, pp.7 - 12, 2001-06 |
Strength Degradation from Contact Fatigue in Self-toughened Glass-Ceramics Lee, Kee-Sung; Kim, Do-Kyung; Woo, Sang-Kuk; Han, Moon-Hee, 한국세라믹학회지, v.7, no.2, pp.63 - 69, 2001-06 |
Effect of tangential loading on critical conditions for radial cracking in brittle coatings Lee, CS; Lawn, BR; Kim, Do Kyung, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.84, no.11, pp.2719 - 2721, 2001-11 |
Material and Geometrical Design for High Reliability Bilayer Lee,Kee Sung; Woo,Sang Kuk; Han,Moon Hee; Kim,Ik Jin; Kim,Do Kyung, MATALS AND MATERIALS INTERNATIONAL , v.7, no.6, pp.531 - 537, 2001-12 |
열가수분해 및 수열결정화에 의한 구형 ZrO2 분말의 합성 조철희; 김명희; 최재영; 김도경, 한국세라믹학회지, v.39, no.4, pp.420 - 426, 2002-04 |
Effect of Al2O3, MgO and SiO2 on Sintering and Hydration Behaviors of CaO Ceramics 조철희; 구봉진; 이기성; 김도경, 한국세라믹학회지, v.39, no.6, 2002-06 |
Cyclic Fatigue-Crack Propagation Behavior in Silicon Carbide: Long- and Small-Crack Behavior Han, YS; Kim, Do Kyung; Gilbert, CJ; Ritchie, RO, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.84, no.3, pp.551 - 554, 2001-03 |
Synthesis of in-situ TiC-Al composite by dipping exothermic reaction process Song, IH; Kim, Do Kyung; Hahn, YD; Kim, HD, METALS AND MATERIALS INTERNATIONAL, v.10, pp.301 - 306, 2004-06 |
The effect of grain boundary phase on contact damage resistance of alumina ceramics Kim, JH; Lee, S; Lee, KS; Kim, Do Kyung, JOURNAL OF MATERIALS SCIENCE, v.39, pp.7023 - 7030, 2004-12 |
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