Kang, Seung-Mo; Shin, Jung Ho; Kim, Jeong Hyeon; Kang, Hyun Seok; Jung, Chang Kyu; Lee, Han Eol; Bae, Byeong-Soo, Nano Energy, v.127, 2024-08
Baek, Ji Hyun; Im, In Hyuk; Hur, Eun-Mi; Park, Jungwon; Lim, Jongwoo; Kim, Sangbum; Kang, Kibum; Kim, SY; Song, JY; Jang, Ho Won, MATERIALS RESEARCH BULLETIN, v.176, 2024-08
Park, Hyeonghun; Seol, Woojun; Park, Geumyong; Anoop, Gopinathan; Kim, Juhun; Tamulevicius, Tomas; Tamulevicius, Sigitas; Joo, Soyun; HONG, DANIEL SEUNGBUM; Jo, Ji Young; Kim, Hyeong-Jin, APPLIED SURFACE SCIENCE, v.660, 2024-07
Choi, Minhyuk; Oh, Saeyoung; Hahn, Sungsoo; Ji, Yubin; Jo, Min-kyung; Kim, Jeongtae; Ju, Tae-Seong; Kim, Gyeongbo; Gyeon, MinSeung; Lee, Yuhwa; Do, Jeonghyeon; Choi, Seungwook; Kim, Ansoon; Yang, Seungmo; Hwang, Chanyong; Kim, Kab-Jin; Cho, Doohee; Kim, Changyoung; Kang, Kibum; Jeong, Hu Young; Song, Seungwoo, ACS Nano, v.18, no.23, pp.15154 - 15166, 2024-06
Kim, TaeSoo; Noh, Gichang; Kwon, Seongdae; Kim, Ji Yoon; Dhakal, Krishna P.; Oh, Saeyoung; Chai, Hyun-Jun; Park, Eunpyo; Kim, In Soo; Lee, Eunji; Kim, Youngbum; Lee, Jaehyun; Jo, Min-kyung; Kang, MinSoo; Park, Cheolmin; Kim, Jeongho; Park, Jeongwon; Kim, Suhyun; Kim, Mingyu; Kim, Yuseok; Choi, Sung-Yool; Song, Seungwoo; Jeong, Hu-Young; Kim, Jeongyong; Kwak, Joon Young; Kang, Kibum, ADVANCED FUNCTIONAL MATERIALS, v.34, no.23, 2024-06
Wang, Xuejing; Kim, Kyungtae; Derby, Benjamin K.; McGuckin, Terrence; Calderon, Gabriel A.; Pettes, Michael T.; Hwang, Jinwoo; Kim, Yeonhoo; Park, Jeongwon; Chen, Aiping; Kang, Kibum; Yoo, Jinkyoung, NANOSCALE, v.16, no.23, pp.11156 - 11162, 2024-06
Jung, Heechan; Lee, Sangwon; Kang, Taehyeok; Zargaran, Alireza; Choi, Pyuck-Pa; Sohn, Seok Su, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.181, pp.71 - 81, 2024-05
Pornnoppadol, Gahsidit; Cho, Soojeong; Yu, Jeong Heon; Kim, Shin-Hyun; Nam, Yoon Sung, MOLECULAR SYSTEMS DESIGN & ENGINEERING, v.9, no.5, pp.507 - 517, 2024-05
Lee, Jeong-A; Cho, Yoonhan; Kim, Saehun; Kweon, Seong Hyeon; Kang, Haneul; Byun, Jeong Hwan; Kwon, Eunji; Seo, Samuel; Ryu, Kyoung Han; Kim, Wonkeun; Kwak, Sang Kyu; Choi, Nam-Soon; HONG, DANIEL SEUNGBUM, ADVANCED SCIENCE, v.11, no.17, 2024-05
Oh, Jimin; Yeom, Jiwon; Madika, Benediktus; Kim, Kwang Man; Liow, Chi Hao; Agar, Joshua C; Hong, Seungbum, NPJ COMPUTATIONAL MATERIALS, v.10, no.1, 2024-05
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging Yim, Myung Jin; Li, Yi; Moon, Kyoung-sik; Paik, Kyung-Wook; Wong, C. P., JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.22, no.14, pp.1593 - 1630, 2008 |
Screen printable Epoxy/BaTiO(3) Embedded capacitor pastes with high dielectric constant for organic substrate applications Jang, Kyung-Woon; Paik, Kyung-Wook, JOURNAL OF APPLIED POLYMER SCIENCE, v.110, no.2, pp.798 - 807, 2008-10 |
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application Yim, Myung-Jin; Paik, Kyung-Wook, ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.7 - 14, 2006-03 |
A study on dielectric constants of epoxy/SrTiO3 composite for embedded capacitor films (ECFs) Lee, Sangyong; Hyun, Jin-Gul; Kim, Hyungsoo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.3, pp.428 - 433, 2007-08 |
Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, pp.306 - 312, 2007-10 |
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity 임명진; 김형준; 백경욱, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03 |
반도체 패키지용 이방성 전도성 접착제 기술의 최신 동향 임명진; 백경욱, 세라미스트, v.8, no.6, pp.23 - 39, 2005-12 |
Characterization of Cu(In,Ga)3Se5 thin film for top cell in CIGS tandem solar cells Kim, KH; Ahn, Byung Tae; Kwon, SH; Yun, JH; Yoon, KH, DIFFUSION AND DEFECT DATA PT.B: SOLID STATE PHENOMENA, v.124-126, no.PART 2, pp.959 - 962, 2007 |
Effects of Se atmosphere on the densificaron of absorber layer using Cu(In,Ga)Se2 nanoparticles for solar cells Kim, KH; Ahn, SJ; Ahn, Byung Tae; Yoon, KH, DIFFUSION AND DEFECT DATA PT.B: SOLID STATE PHENOMENA, v.124-126, no.PART 2, pp.983 - 986, 2007 |
Fracture resistance and contact damage of TiN particle reinforced Si3N4 ceramics Tatami, J; Chen, IW; Yamamoto, Y; Komastu, M; Komeya, K; Kim, Do Kyung; Wakihara, T; et al, JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, v.114, pp.1049 - 1053, 2006-11 |
연소합성을 이용한 저온형 고체산화물 연료전지용 나노구조 세리아계 전해질 제조 김종호; 조승환; 김도경, 한국세라믹학회지, v.42, no.12, pp.821 - 826, 2005-12 |
Electrical characterization of dense and porous nanocrystalline Gd-doped ceria electrolytes Jo, Seung Hwan; Muralidharan, P.; Kim, Do Kyung, SOLID STATE IONICS, v.178, no.39-40, pp.1990 - 1997, 2008-03 |
TiB2 나노 입자의 연소합성시 MgO 희석제가 미치는 영향 이병기; 이종무; 박제형; 강을손; 백승수; 김도경, 한국세라믹학회지, v.42, no.9, pp.607 - 612, 2005-09 |
화학증착법에 의하여 제조된 탄화규소 코팅층의 기계적 특성 이현근; 김종호; 김도경, 한국세라믹학회지, v.43, no.8, pp.492 - 497, 2006-08 |
Deformation behaviors of Zr-based bulk metallic glass under impact indentation Shin, Hyung-Seop; Chang, Soon-Nam; Kim, Do Kyung, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.22, no.9-11, pp.1775 - 1782, 2008-04 |
Special issue: 6th International Symposium on Impact Engineering (ISIE2007), Daejeo 19 September 2007 - Preface Chung, Dong-Teak; Shin, Hyung-Seop; Kim, Do Kyung, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.22, no.9-11, pp.III - III, 2008-04 |
Gadolinium-doped Ceria/Magnesia (CGO/MgO) 복합체 전해질의 전기적 특성 분석 김도경; 조승환; P. Muralidharan, 한국재료학회지, v.18, no.9, pp.470 - 474, 2008-09 |
In vitro biocompatibility of equal channel angular processed (ECAP) titanium Kim, Taik Nam; Balakrishnan, A; Lee, BC; Kim, WS; Smetana, K; Park, Joong Keun; Panigrahi, BB, BIOMEDICAL MATERIALS, v.2, no.3, pp.S117 - S120, 2007-09 |
Electrical Conductivity of Submicrometer Gadolinia-Doped Ceria Sintered at 1000 degrees C Using Precipitation-Synthesized Nanocrystalline Powders Muralidharan, P; Jo, SH; Kim, Do Kyung, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.91, pp.3267 - 3274, 2008-10 |
Numerical simulation of stress-strain curve of duplex stainless steel Yang, Q.-X.; Wu, J.; Zhao, H.; Park, Joong Keun, CAILIAO RECHULI XUEBAO/TRANSACTIONS OF MATERIALS AND HEAT TREATMENT, v.26, no.5, pp.124 - 128, 2005-10 |
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