MS-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 4081 to 4100 of 7245

4081
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Yim, Myung Jin; Li, Yi; Moon, Kyoung-sik; Paik, Kyung-Wook; Wong, C. P., JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.22, no.14, pp.1593 - 1630, 2008

4082
Screen printable Epoxy/BaTiO(3) Embedded capacitor pastes with high dielectric constant for organic substrate applications

Jang, Kyung-Woon; Paik, Kyung-Wook, JOURNAL OF APPLIED POLYMER SCIENCE, v.110, no.2, pp.798 - 807, 2008-10

4083
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application

Yim, Myung-Jin; Paik, Kyung-Wook, ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.7 - 14, 2006-03

4084
A study on dielectric constants of epoxy/SrTiO3 composite for embedded capacitor films (ECFs)

Lee, Sangyong; Hyun, Jin-Gul; Kim, Hyungsoo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.3, pp.428 - 433, 2007-08

4085
Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications

Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, pp.306 - 312, 2007-10

4086
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

임명진; 김형준; 백경욱, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03

4087
반도체 패키지용 이방성 전도성 접착제 기술의 최신 동향

임명진; 백경욱, 세라미스트, v.8, no.6, pp.23 - 39, 2005-12

4088
Characterization of Cu(In,Ga)3Se5 thin film for top cell in CIGS tandem solar cells

Kim, KH; Ahn, Byung Tae; Kwon, SH; Yun, JH; Yoon, KH, DIFFUSION AND DEFECT DATA PT.B: SOLID STATE PHENOMENA, v.124-126, no.PART 2, pp.959 - 962, 2007

4089
Effects of Se atmosphere on the densificaron of absorber layer using Cu(In,Ga)Se2 nanoparticles for solar cells

Kim, KH; Ahn, SJ; Ahn, Byung Tae; Yoon, KH, DIFFUSION AND DEFECT DATA PT.B: SOLID STATE PHENOMENA, v.124-126, no.PART 2, pp.983 - 986, 2007

4090
Fracture resistance and contact damage of TiN particle reinforced Si3N4 ceramics

Tatami, J; Chen, IW; Yamamoto, Y; Komastu, M; Komeya, K; Kim, Do Kyung; Wakihara, T; et al, JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, v.114, pp.1049 - 1053, 2006-11

4091
연소합성을 이용한 저온형 고체산화물 연료전지용 나노구조 세리아계 전해질 제조

김종호; 조승환; 김도경, 한국세라믹학회지, v.42, no.12, pp.821 - 826, 2005-12

4092
Electrical characterization of dense and porous nanocrystalline Gd-doped ceria electrolytes

Jo, Seung Hwan; Muralidharan, P.; Kim, Do Kyung, SOLID STATE IONICS, v.178, no.39-40, pp.1990 - 1997, 2008-03

4093
TiB2 나노 입자의 연소합성시 MgO 희석제가 미치는 영향

이병기; 이종무; 박제형; 강을손; 백승수; 김도경, 한국세라믹학회지, v.42, no.9, pp.607 - 612, 2005-09

4094
화학증착법에 의하여 제조된 탄화규소 코팅층의 기계적 특성

이현근; 김종호; 김도경, 한국세라믹학회지, v.43, no.8, pp.492 - 497, 2006-08

4095
Deformation behaviors of Zr-based bulk metallic glass under impact indentation

Shin, Hyung-Seop; Chang, Soon-Nam; Kim, Do Kyung, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.22, no.9-11, pp.1775 - 1782, 2008-04

4096
Special issue: 6th International Symposium on Impact Engineering (ISIE2007), Daejeo 19 September 2007 - Preface

Chung, Dong-Teak; Shin, Hyung-Seop; Kim, Do Kyung, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.22, no.9-11, pp.III - III, 2008-04

4097
Gadolinium-doped Ceria/Magnesia (CGO/MgO) 복합체 전해질의 전기적 특성 분석

김도경; 조승환; P. Muralidharan, 한국재료학회지, v.18, no.9, pp.470 - 474, 2008-09

4098
In vitro biocompatibility of equal channel angular processed (ECAP) titanium

Kim, Taik Nam; Balakrishnan, A; Lee, BC; Kim, WS; Smetana, K; Park, Joong Keun; Panigrahi, BB, BIOMEDICAL MATERIALS, v.2, no.3, pp.S117 - S120, 2007-09

4099
Electrical Conductivity of Submicrometer Gadolinia-Doped Ceria Sintered at 1000 degrees C Using Precipitation-Synthesized Nanocrystalline Powders

Muralidharan, P; Jo, SH; Kim, Do Kyung, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.91, pp.3267 - 3274, 2008-10

4100
Numerical simulation of stress-strain curve of duplex stainless steel

Yang, Q.-X.; Wu, J.; Zhao, H.; Park, Joong Keun, CAILIAO RECHULI XUEBAO/TRANSACTIONS OF MATERIALS AND HEAT TREATMENT, v.26, no.5, pp.124 - 128, 2005-10

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