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Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM Kwon,Yong-Min; Jeon,Young-Doo; Paik, Kyung-Wook; Kin, Jung-Do; Lee, Jin-Woo, ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.37 - 42, 2006-03 |
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application Yim, Myung-Jin; Paik, Kyung-Wook, ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.7 - 14, 2006-03 |
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