Browse "MS-Journal Papers(저널논문)" by Subject LEAD-FREE SOLDERS
Showing results 1 to 23 of 23
| A thermodynamic study of phase equilibria in the Sn-Bi-Pb solder system Yoon, SW; Lee, HyuckMo, CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, v.22, no.2, pp.167 - 178, 1998 |
| Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.20, no.8, pp.1931 - 1934, 2005-08 |
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate Choi, WK; Yoon, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.42, no.5, pp.783 - 789, 2001 |
| Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate Choi, WK; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.11, pp.1251 - 1255, 1999 |
| Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad Jee, YK; Ko, YH; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.7, pp.1879 - 1887, 2007-07 |
| Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders Chang, Jaewon; Seo, Sun-Kyoung; Cho, Moon Gi; Lee, Dong Nyung; Kang, Kyoo-Sik; Lee, Hyuck Mo, JOURNAL OF MATERIALS RESEARCH, v.27, no.14, pp.1877 - 1886, 2012-07 |
| Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 |
| Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
| Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints Lee, K. O.; Yu, Jin; Park, T. S.; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03 |
| Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints Yu, Jin; Kim, J. Y., ACTA MATERIALIA, v.56, no.19, pp.5514 - 5523, 2008-11 |
| Effects of Solder Ball Geometry on Lap Shear Creep Rate Kim, Sung-Bum; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.3, pp.326 - 332, 2010-03 |
| Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.534 - 543, 2009-02 |
| Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads Jee, Young-Kun; Ko, Yong-Ho; Sohn, Yoon-Chul; Yu, Jin, ELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.161 - 166, 2006-12 |
| Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 |
| Microstructural discovery of Al addition on Sn-0.5Cu-based Pb-free solder design Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck-Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.650, pp.106 - 115, 2015-11 |
| New Synthesis Approach for Low Temperature Bimetallic Nanoparticles: Size and Composition Controlled Sn-Cu Nanoparticles Jo, Yun-Hwan; Park, Ji-Chan; Bang, Jung-Up; Song, Hyun-Joon; Lee, Hyuck-Mo, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.11, no.2, pp.1037 - 1041, 2011-02 |
| Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200A degrees C, 500A degrees C, and 800A degrees C Chang, Jaewon; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.12, pp.2643 - 2652, 2010-12 |
| Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation Lee, BJ; Hwang, NM; Lee, Hyuck Mo, ACTA MATERIALIA, v.45, no.5, pp.1867 - 1874, 1997-05 |
| Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| Rupture time analyses of the Sn-3.5Ag solder alloys containing Cu or Bi Yu, Jin; Joo, DK; Shin, SW, ACTA MATERIALIA, v.50, no.17, pp.4315 - 4324, 2002-10 |
| Thermodynamics-aided alloy design and evaluation of Pb-free solder, Sn-Bi-In-Zn system Yoon, SW; Soh, JR; Lee, HyuckMo; Lee, BJ, ACTA MATERIALIA, v.45, no.3, pp.951 - 960, 1997 |
| Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; Wang, Xingxing; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10 |
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