Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Varying amounts of Zn(1, 3, and 7wt%) were added to Sn-3.5Ag solder on a Cu pad, and the effects of Zn on the interface microstructure and drop resistance were investigated. Results indicate that addition of 3wt% Zn increased the number of drops to failure (N-f) by about two times and that aging generally deteriorated the drop reliability. The beneficial role of Zn was ascribed to the suppression of Cu6Sn5 at the joint interface. Effects of aging were assumed to lead to the formation of double IMC layers (0Zn, 1Zn) and decomposition of Ag5Zn8 into brittle Ag3Sn and Cu6Sn5.
- Publisher
- Korean Inst Metals Materials
- Issue Date
- 2006-12
- Language
- English
- Article Type
- Article
- Citation
ELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.161 - 166
- ISSN
- 1738-8090
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
This item is cited by other documents in WoS
| ⊙ Detail Information in WoSⓡ | Click to see |  |
| ⊙ Cited 2 items in WoS | Click to see citing articles in |  |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.