Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation

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A new scheme to predict the intermetallic compound which forms first at the substrate/solder interface during the soldering process has been suggested. A local equilibrium was assumed at the interface between the substrate and the liquid solder. By calculating metastable equilibria between the substrate and the liquid solder phases and by comparing the calculated driving forces of formation for individual phases, the compound which forms first at the substrate/solder interface could be successfully predicted. The prediction of interface reactions between Cu substrate and Sn-Pb, Sn-Bi and Sn-Zn binary eutectic solder was in agreement with already known experimental results.
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Issue Date
1997-05
Language
English
Article Type
Article
Keywords

LEAD-FREE SOLDERS; PHASE-DIAGRAM; DESIGN; SYSTEM

Citation

ACTA MATERIALIA, v.45, no.5, pp.1867 - 1874

ISSN
1359-6454
DOI
10.1016/S1359-6454(96)00325-4
URI
http://hdl.handle.net/10203/2453
Appears in Collection
MS-Journal Papers(저널논문)
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