Lee, Keon Jae, Acoustics 2023, 2023-12-06
Takayuki Shiino; Kim, Geunwoo; Phuock, Cao Van; Jeong, Jong-Ryul; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
Shin, Soyoung; Lee, Soogil; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
Koh, Daekyu; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
Lee, Won-Bin; Park, Byong-Guk; Lee, Kyung-Jin; Choi, Gyung-Min, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
Pi, Jinju; Seo, Seongbin; Park, Jungmin; Kim, Geunwoo; Park, Byong-Guk; Kim, Sanghoon, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
Han, DongHyeon; Shin, Chaehyeon; Kim, Seok-Jong; Jang, Yunho; Lee, Geun-hee; Ryu, Jeongchun; Kohda, Makoto; Nitta, Junsaku; Kim, Kab-Jin; Park, Jongsun; Lee, Kyung-Jin; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
공태영; 류호진; 홍순형, 한국분말재료학회 2023 추계학술발표회, 2023-12-01
Ko, JiWoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-12-01
Cho, Yeongin; Pyeon, Jeongsu; Kim, Hyoungsoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-11-29
Reliable artificial leaky integrate and fire (LIF) neuron device using 2D material Ahn, Wonbae; Ham, Ayoung; Oh, Jungyeop; Kang, Kibum; Choi, Sung-Yool, The 12th International Workshop on 2D Materials (A3 Workshop), Nanjing university, 2023-07-20 |
Towards the standardization of fullerene nanofibers using Raman spectroscopy Martins Ferreira, Erlon H; Ren, Lingling; Piao, Guangzhe; Hong, Soon Hyung; Tachibana, Masaru; Sergo, Valter; Bonifacio, Alois; et al, 17th International Congress of Metrology, CIM 2015, EDP Sciences, 2015-09 |
Nanofiber ACFs (anisotropic conductive films) for ultra-fine pitch interconnection Paik, Kyung-Wook; Lee, Sang-Hoon; Kim, Tae-Wan, 15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015, pp.581 - 587, Institute of Electrical and Electronics Engineers Inc., 2015-07 |
Porous graphene layers on Pt catalyst for long-term stability of fuel cell electrode Kim, Heeyeon; Robertson, Alex W; Warner, Jamie H; Kim, Sang Ouk, Symposium on Polymer Electrolyte Fuel Cells 16, PEFC 2016 - PRiME 2016/230th ECS Meeting, pp.837 - 840, Electrochemical Society Inc., 2016-10 |
Contact localization through spatially overlapping piezoresistive signals Piacenza, Pedro; Xiao, Yuchen; Park, Steve; Kymissis, Ioannis; Ciocarlie, Matei, 2016 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2016, pp.195 - 201, IEEE Robotics and Automation Society (RAS), 2016-10 |
Multi-functional touch sensors with strained P(VDF-TrFE) deposited on metal oxide thin film transistor Jin, Taiyu; Ryu, Jeongjae; Kang, Hansaem; No, Kwangsoo; Park, Sang-Hee Ko, 23rd International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2016, pp.209 - 210, Institute of Electrical and Electronics Engineers Inc., 2016-07 |
Flexibility of anisotropic conductive films (ACFS) bonded CIF(Chip in Flex) package for wearable electronics applications Paik, Kyung-Wook; Kim, Jihye; Kim, Young R, Pan Pacific Microelectronics Symposium, Pan Pacific 2016, Institute of Electrical and Electronics Engineers Inc., 2016-01 |
Highly stable top gate top contact ITZO TFT deposited by using high density plasma sputtering Ahn, Jae Han; Lee, Kwang Heum; Do, Jae Chul; Park, Wan Woo; Park, Sang-Hee Ko, 23rd International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2016, pp.183 - 184, Institute of Electrical and Electronics Engineers Inc., 2016-07 |
Interface Adhesion Effect of Anchoring Polymer Layer Anisotropic Conductive Films on the Bending Reliability for Ultra-fine Pitch Wearable Chip-on-Flex Packages Pan, Yan; Peng, Xiaohui; Zhu, Pengli; Sun, Rong; Paik, Kyung-Wook, 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, Institute of Electrical and Electronics Engineers Inc., 2022-08 |
Application of multicomponent phase diagrams in understandting phase evolution of solders/UBM system Kim, Jong Hoon; Lee, Hyuck-Mo, 33rd CALPHAD Meeting, 33rd CALPHAD Meeting, 2004-06-03 |
Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads Zhang, Shuye; Xu, Jianhao; Zhang, Shang; He, Peng; Sun, Mingjia; Yang, Jianqun; Li, Xingji; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021-06 |
Effects of the citrate-coated nanosized Ag pastes on joining reliable Cu-Cu joints for Current 3D ICs Zhang, Shuye; Duan, Xiaokang; Li, Zhenfeng; Xu, Jiaohao; Wang, Dayin; Zhang, Shang; He, Peng; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), pp.1957 - 1962, IEEE, 2021-06 |
Concurrent inverse design of structured light and metasurface for nanopatterning process Kim, Myungjoon; Kim, Nayoung; Shin, Jonghwa, Frontiers in Optics, FiO 2022, Optica Publishing Group (formerly OSA), 2022-10 |
Invited talk: 2D and 3D nanostructuring strategies for thermoelectric materials Jeon, Seokwoo, Engineering Sustainable Development Conference 2019, pp.7 - 8, AIChE, 2019-12 |
Application of Rapid Thermal Annealing Process to the Display Technology Park, Sang-Hee Ko; Ji, Sanghyun; Jeong, Pilseong; Nam, Yunyong; Yang, Jong-Heon; Hwang, Chi-Sun, SID Symposium, Seminar, and Exhibition 2018, Display Week 2018, pp.748 - 750, John Wiley and Sons Inc, 2018-05 |
A study on the high frequency performance of solder ACFs joints for flex-on-board applications using coplanar waveguide Zhang, Shuye; Lin, Tiesong; He, Peng; Park, Junyong; Park, Gap Yeol; Song, Huijin; Kim, Joungho; et al, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, pp.2404 - 2409, Institute of Electrical and Electronics Engineers Inc., 2018-05 |
Effect of the curing properties and viscosities of non-conductive films (NCFs) on ultra-fine pitch cu-pillar/sn-ag bump joint morphology and reliability Lee, HanMin; Choi, TaeJin; Park, SooIn; Paik, Kyung-Wook, 21st IEEE Electronics Packaging Technology Conference, EPTC 2019, pp.586 - 590, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
Effects of the Anchoring Polymer Layer (APL) Materials on Conductive Particle Movements for Ultra-Fine Pitch Chip-on-Glass (COG) Interconnection Yoon, Dal Jin; Paik, Kyung-Wook, SID Symposium, Seminar, and Exhibition 2018, Display Week 2018, pp.1113 - 1116, John Wiley and Sons Inc, 2018-05 |
Flexible Mutual-capacitive Fingerprint Sensor with Hard and Flexible Overlaid Dielectric Layer for Biometrics Application Lee, Seung Hee; Jeon, Guk-Jin; Kim, Yong Ho; Kang, Il-Suk; Kim, Hongchae; Bae, Byeong-Soo; Park, Sang-Hee Ko, SID Symposium, Seminar, and Exhibition 2018, Display Week 2018, pp.87 - 89, John Wiley and Sons Inc, 2018-05 |
Quantum Dot/Siloxane Composite Film Exceptionally Stable Against Heat and Moisture Kim, Hwea Yoon; Yoon, Da-Eun; Jang, Junho; Choi, Gwang-Mun; Lee, Doh Chang; Bae, Byeong-Soo, SID Symposium, Seminar, and Exhibition 2017, Display Week 2017, pp.451 - 454, John Wiley and Sons Inc, 2017-05 |
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