Flexible Mutual-capacitive Fingerprint Sensor with Hard and Flexible Overlaid Dielectric Layer for Biometrics Application

Abstract

We present cost-effective flexible fingerprint sensor for biometrics application beyond Si-based material. Our Cu electrode based fingerprint sensors were fabricated on PI substrate with flexible and durable overlaid dielectric material. Overlaid layer has roles of both the dielectric layer of capacitance and protective layer from the environment in place of reinforced glass. The planarization of Cu electrode suppresses generation of noise signal between the electrodes, resulting in realistic fingerprints.