Lee, Keon Jae, Acoustics 2023, 2023-12-06
Takayuki Shiino; Kim, Geunwoo; Phuock, Cao Van; Jeong, Jong-Ryul; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
Shin, Soyoung; Lee, Soogil; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
Koh, Daekyu; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
Lee, Won-Bin; Park, Byong-Guk; Lee, Kyung-Jin; Choi, Gyung-Min, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
Pi, Jinju; Seo, Seongbin; Park, Jungmin; Kim, Geunwoo; Park, Byong-Guk; Kim, Sanghoon, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
Han, DongHyeon; Shin, Chaehyeon; Kim, Seok-Jong; Jang, Yunho; Lee, Geun-hee; Ryu, Jeongchun; Kohda, Makoto; Nitta, Junsaku; Kim, Kab-Jin; Park, Jongsun; Lee, Kyung-Jin; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
공태영; 류호진; 홍순형, 한국분말재료학회 2023 추계학술발표회, 2023-12-01
Ko, JiWoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-12-01
Cho, Yeongin; Pyeon, Jeongsu; Kim, Hyoungsoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-11-29
The Effects of Moisture Content on Homogeneity of Dispersion Fuels HONG SOON HYUNG, , 2000-01-01 |
Fabrication Process and Analysis of Thermal Properties of High Volume Fraction SiCp/Al Metal Matrix Composites for Heatsink Materials Hong, Soon Hyung, Fall Meeting of the Korean Society for Composite materials, pp.58 - 62, 복합재료학회, 2000-10-01 |
The Analysis of Mechanical and Ballistic Property for 2519 Aluminum Armor Plate Hong, Soon Hyung, pp.257 - 266, 2000-01-01 |
Effect of Thermal Treatment on Carbide Precipitation in Inconel 690 Alloy for Steam Generator Tubes HONG SOON HYUNG, pp.1155 - 1167, 2000-01-01 |
Comparison of Acoustic Attenuation Measurement Technique of Polyethylene Matrix Composite Materials Hong, Soon Hyung, Fall Meeting of the Acoustic Society for Korea, pp.265 - 268, 한국음향학회, 1999-01-01 |
Effect of Powder Shape and Size on Homogeneity of U3Si/Al Powder Mixture for Research Reactor Hong, Soon Hyung, pp.259 -, 1999-01-01 |
New Anisotropic Conductive Adhesives for Low Cost and Reliable Flip Chip on Organic Substrates Applications Yim, MJ; Paik, Kyung-Wook, 2000 Int’l Symp on Electronic Materials & Packaging, pp.282 - 288, 2000 Int’l Symp on Electronic Materials & Packaging, 2000-11-01 |
Mechanical Properties of Carbon/Phenolic Ablative Composites Hong, Soon Hyung, Fall Meeting of Korean Society of Composite Materials, pp.160 - 163, 한국복합재료학회, 1999-01-01 |
전기화학적 방법을 이용한 이상 스테인리스강의 '475 ℃ 취성'평가 권혁상; 박찬진, 한국부식학회 춘계학술발표회, 한국부식학회, 1999 |
재부동태 속도론에 의한 합금 690의 응력부식균열 민감도 예측 권혁상; 안세진, 한국부식학회 춘계학술발표회, 한국부식학회, 1999 |
r. f. 스퍼터링으로 제조한 비정질 LixV2O5-y 박막 양극의 충방전 특성 및 GITT법을 이용한 리튬 이온 확산계수 결정 권혁상; 이상동, 한국부식학회 춘계학술발표회, 한국부식학회, 1999 |
475 ℃ 시효처리와 W첨가가 이상 스테인리스강의 기계적 성질 및 부식특성에 미치는 영향 권혁상; 박찬진, 대한금속학회 춘계학술발표회, 대한금속학회, 1999 |
Photosensitive Gel Film in the System of γ-Glycidoxypropyltrimethoxysilane(GPTS)-Chelated Metal Alkoxides Bae, Byeong-Soo; Kim, HR; Park, OH; Choi, YK, Sol-Gel '99, 1999 |
레이저 간섭계(ESPI)를 이용한 Sn/Pb 솔더 접합부의 열사이클에 따른 열변형 형태 평가 장우순; 김동원; 권동일; 나재웅; 백경욱, 대한 금속재료학회 2001년도 춘계학술대회, pp.80 - 80, 대한 금속재료학회, 2001-04-27 |
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, YJ; Paik, Kyung-Wook; Koh, KW; Woon, JH; Choi, SH; Lee, J; et al, Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001, pp.44 - 51, International Symposium on Electronic Matericals and Packaging, 2001-11 |
열하중시 플립칩 변형장 평가를 위한 ESPI와 유한요소해석의 적용 이백우; 장우순; 김동원; 권동일; 장재일; 백경욱, 대한금속 재료학회 2001년도 추계학술대회, pp.81 - 81, 대한금속 재료학회, 2001-10-26 |
Cu/Al 금속간화합물 형성이 구리와이어의 본딩신뢰성에 미치는 영향 김형준; 이주연; 나재웅; 백경욱, 대한금속 재료학회 2001년도 추계학술대회, pp.73 - 73, 대한금속 재료학회, 2001-10-01 |
Anisotropic Conductive Adhesives Flip Chip Technology Paik, Kyung-Wook, Asymtek & Tsinghua University Workshop, pp.0 - 0, 2001-05-01 |
Significant Reliablity Enhancement Using New Anisotropic Conductive Adhesives for Flip Chip on Organic Substrates Applications Paik, Kyung-Wook; Kwon, WS; Yim, MJ, 2001 Pan Pacific Microelectronics Symposium, pp.217 - 223, Pan Pacific Microelectronics Symposium, 2001-02-01 |
Tensile Behavior of Particle Reinforced EPDM Rubber Composites Hong, Soon-Hyung, pp.409 - 414, 2002-09-01 |
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