레이저 간섭계(ESPI)를 이용한 Sn/Pb 솔더 접합부의 열사이클에 따른 열변형 형태 평가Evaluation of thermal deformation by thermal cycling in Pb/Sn solder joint using laser interferometry
- Publisher
- 대한 금속재료학회
- Issue Date
- 2001-04-27
- Language
- KOR
- Citation
대한 금속재료학회 2001년도 춘계학술대회, pp.80 - 80
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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