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Comparison between Electroless Ni(P)Au and Cu OSP as a Surface Finish Layer of Mobile Application Yu, Jin; Sohn, YC; Jee, YK; Seo, HS; Kim, KH; Ahn, JH; Lee, YM, IMAPS 2005 Proceedings, 2005 |
The development of red emitting ZnS:Cu,Cl,Mn,Te AC powder electroluminescent (ACPEL) phosphor Park, BJ; Han, JY; Jeon, Duk Young; Seo, HS; Ahn, JT; Oh, DK; Park, SH; et al, 16th International Display Workshops, IDW '09, v.1, pp.379 - 381, 2009-12-09 |
Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, KW; Kim, JS; Oh, SH; Seo, HS, 제5회 한국반도체 학술대회, pp.587 - 588, 한국반도체 학술대회, 1998-02-01 |
Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, Kyung-Wook; Kim, JS; Oh, SH; Seo, HS, International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453, International Conference and Exhibition on Multichip Modules and High Density Packaging, 1998-04-01 |
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