Browse "MS-Conference Papers(학술회의논문)" by Author Paik, KW
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| Effect of Ag on ripening growth of Cu6Sn5 grains formed between molten Sn-xAg-0.5Cu solders and Cu Cho, MG; Park, YS; Seo, SK; Paik, KW; Lee, Hyuck Mo, 60th Electronic Components and Technology Conference, ECTC 2010, pp.170 - 175, 123, 2010-06-01 |
| Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, KW; Kim, JS; Oh, SH; Seo, HS, 제5회 한국반도체 학술대회, pp.587 - 588, 한국반도체 학술대회, 1998-02-01 |
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