Effect of Ag on ripening growth of Cu6Sn5 grains formed between molten Sn-xAg-0.5Cu solders and Cu

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Issue Date
2010-06-01
Language
ENG
Citation

60th Electronic Components and Technology Conference, ECTC 2010, pp.170 - 175

ISSN
0569-5503
URI
http://hdl.handle.net/10203/164088
Appears in Collection
MS-Conference Papers(학술회의논문)
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