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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effect of Ag on ripening growth of Cu6Sn5 grains formed between molten Sn-xAg-0.5Cu solders and Cu

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dc.contributor.authorCho, MGko
dc.contributor.authorPark, YSko
dc.contributor.authorSeo, SKko
dc.contributor.authorPaik, KWko
dc.contributor.authorLee, Hyuck Moko
dc.date.accessioned2013-03-28T08:18:33Z-
dc.date.available2013-03-28T08:18:33Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2010-06-01-
dc.identifier.citation60th Electronic Components and Technology Conference, ECTC 2010, pp.170 - 175-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/164088-
dc.languageEnglish-
dc.publisher123-
dc.titleEffect of Ag on ripening growth of Cu6Sn5 grains formed between molten Sn-xAg-0.5Cu solders and Cu-
dc.typeConference-
dc.identifier.wosid000287024100026-
dc.identifier.scopusid2-s2.0-77955182098-
dc.type.rimsCONF-
dc.citation.beginningpage170-
dc.citation.endingpage175-
dc.citation.publicationname60th Electronic Components and Technology Conference, ECTC 2010-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationLas Vegas, NV-
dc.contributor.localauthorLee, Hyuck Mo-
dc.contributor.nonIdAuthorCho, MG-
dc.contributor.nonIdAuthorPark, YS-
dc.contributor.nonIdAuthorSeo, SK-
dc.contributor.nonIdAuthorPaik, KW-
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MS-Conference Papers(학술회의논문)
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