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Showing results 1 to 14 of 14

1
Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM)

Paik, Kyung-Wook; Jeon, YD; Nah, JW, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.177 - 184, 2001-07-08

2
Characterization of coined solder bumps on PCB pads

Nah, JW; Paik, Kyung-Wook; Kim, WH; Hur, KR, 52nd Electronic Components and Technology Conference, pp.154 - 160, IEEE, 2002-05-28

3
Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis

Lee, BW; Jeong, JH; Jang, WS; Kim, JY; Kim, DW; Kwon, DI; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, Kyungpook National University, 2002-10

4
Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, v.17, pp.1983 - 1988, The Third International Conference On Advanced Materials Development and Performance, 2003

5
Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature

Nah, JW; Suh, JO; Paik, Kyung-Wook; Tu, KN, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.50 - 53, 2005-03-16

6
Effects of the polymer residues on via contact resistance after reactive ion etching

Ko, HS; Nah, JW; Paik, Kyung-Wook; Park, Y, 20th North American Conference on Molecular Beam Epitaxy, v.20, no.3, pp.1000 - 1007, 2001-10-01

7
Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure

Nah, JW; Kim, JH; Paik, Kyung-Wook; Lee, HM, TMS 2004 133rd Annual Meeting & Exhibition, pp.294, 133rd TMS Annual Meeting, 2004-03

8
Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI)

Jang, W; Lee, BW; Kim, DW; Nah, JW; Paik, Kyung-Wook; Kwon, D, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.310 - 314, 2001-11

9
Flip chip assembly on PCB substrates with coined solder bumps

Nah, JW; Paik, Kyung-Wook; Cho, SJ; Kim, WH, 53rd Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2003-05-27

10
Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads

Nah, JW; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.790 - 795, IEEE, 2001-05-29

11
Microwave characterization and comparison of adhesive flip chip interconnects

Kwon, WS; Jeon, YD; Lee, JH; Nah, JW; Yim, MJ; Paik, Kyung-Wook, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.273 - 278, 2001-07-08

12
Numerical Analysis of the Formation of Coined Solder Bumps

Hwnag, TK; Lee, SB; Nah, JW; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.388 - 392, 3rd International Symposium on Electronic Materials and Packaging, 2001-11

13
Study on Coined Solder Bumps on Micro-via PCBs

Nah, JW; Paik, Kyung-Wook; Kim, WH; Hur, KR, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.115 - 120, 3rd International Symposium on Electronic Materials and Packaging, 2001-11

14
Study on Coined Solder Bumps on PCB Pads

Paik, Kyung-Wook; Nah, JW; Kim, WH; Hur, KR, Proceedings of the 7th Pan Pacific Microelectronics Symposium, pp.79 - 85, 2002-02

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