Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis

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Publisher
Kyungpook National University
Issue Date
2002-10
Language
ENG
Citation

The Third International Conference On Advanced Materials Development and Performance

URI
http://hdl.handle.net/10203/137519
Appears in Collection
MS-Conference Papers(학술회의논문)
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