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Showing results 1 to 12 of 12

1
A study on epoxy/BaTiO3 embedded capacitor pastes for organic substrates

Jang, KW; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.1504 - 1509, IEEE, 2006-05-30

2
Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01

3
Effects of Anisotropic Conductive Film (ACF) viscosity on ACF fillet and moisture-related reliability for Flip-chip-on-board (FCOB) packages

Jang, KW; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19

4
Effects of epoxy and rubber addition on die attach films (DAFs) materials properties

Choi, Y; Jang, KW; Chung, CK; Lee S.; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1525 - 1530, 123, 2009-05-26

5
Effects of heating rate during ACFs curing process on material properties and thermal cycling reliability of flip chip assembly

Jang, KW; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, 2007, pp.1725 - 1730, IEEE, 2007-05-29

6
Epoxy/BaTiO (SrTiO3) Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates

Paik, Kyung-Wook; Hyun, JG; Lee, S; Jang, KW, Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2006-01

7
Epoxy/BaTiO3 (SrTi03) composite films and pastes for high dielectric constant and low tolerance embedded capacitors in organic substrates

Paik, Kyung-Wook; Hyun, JG; Lee, S; Jang, KW, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.794 - 801, 2006-09-05

8
Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates

Hyun, JG; Jang, KW; Cho, SD; Paik, Kyung-Wook; Kim, HS; Kim, JH, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.105 - 111, 2004-09-12

9
High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications

Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28

10
High Reliable Nong-Conductive Adhesives for Flip Chip Interconnections

Kwon, WS; Jang, KW; Paik, Kyung-Wook, 3rd International Symposium on Electronic Materials and Packagings 2001, pp.34 - 38, 2001-11

11
Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications

Jang, KW; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1486 - 1490, IEEE, 2005-05-31

12
Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27

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