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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

High Reliable Nong-Conductive Adhesives for Flip Chip Interconnections

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Kwon, WS / Jang, KW / Paik, Kyung-Wookresearcher
Issue Date
2001-11
Language
ENG
Citation

3rd International Symposium on Electronic Materials and Packagings 2001, pp.34 - 38

URI
http://hdl.handle.net/10203/127623
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MS-Conference Papers(학술회의논문)
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