Browse "MS-Conference Papers(학술회의논문)" by Title
Showing results 3621 to 3640 of 7321
| Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads Nah, JW; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.790 - 795, IEEE, 2001-05-29 |
| Investigation of Mechanical Property and Thermal Conductivity of Pressureless Sintered Silicon Nitride Ceramics with Rare-Earth Oxide additives 공정훈; 정욱기; 마호진; 김도경, 2018년도 한국재료학회 춘계학술대회, 한국재료학회, 2018-05-17 |
| Investigation of Nano Phase Diagram and Structural Change of Ag-Au Bimetallic Nanoparticles and Its Applications Yeo, Sang Chul; Kim, Da Hye; Shin, Kihyun; Lee, Hyuck Mo, 41st CALPHAD, 2012-06-04 |
| Investigation of Oxygen Reduction Reaction on Porous (La0.85Sr0.15)0.9MnO3 -YSZ Composite Electrode for Solid Oxide Fuel Cell Pyun, Su Il, 46th Battery Symposium in Japan, pp.620 - 621, 2005 |
| Investigation of Radiation Effect on Magnetic Tunnel Junction against Proton and Ion Beam Park, June-Young; Kim, Jeongmok; Ryu, Jeong-Chun; Park, Byong-Guk, 64th Annual Magnetism & Magnetic Materials Conference (MMM 2019), AIP Publishing & IEEE Magnetics Society, 2019-11-07 |
| Investigation of resistive probes with high sensitivity Kim, Sang Wan; Song, Jae Young; Kim, Jong Pil; Choi, Woo Young; Chung, Han Ki; Park, Jae Hyun; Ko, Hyungsoo; et al, IEEE 2008 Silicon Nanoelectronics Workshop, SNW 2008, IEEE, 2008-06 |
| Investigation of Self-reinforced and High-thermal Conductive Silicon Nitride with Pressureless Multi-step Sintering 공정훈; 김도경; 마호진, 2020 엔지니어링세라믹스 심포지엄, 한국세라믹학회, 2020-12-04 |
| Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Aging Conditions Chang, Jaewon; Kang, Sung; Lee, Jaeho; Kim, Keun-Soo; Lee, Hyuck Mo, 2013 TMS annual meeting (142nd), The Minerals, Metals & Materials Society, 2013-03-04 |
| Investigation of Solidification Cracking of High Strength Aluminum Alloy Nam, Soo Woo, Int'l Symp. of 47th Annul Assembly of International Institute of Welding, pp.147 - 158, 1994 |
| Investigation of stress corrosion cracking susceptibility of 200 series stainless steel alloys by using slow strain rate technique Kwon, Hyuk-Sang, he 56th Annual Meeting of the international Society of Electrochemistry, pp.0 - 0, 2005-09-01 |
| Investigation of Tetragonality of 1D Barium Titanate Nanowire Synthesized by Hydrothermal Process 오성찬; 김도경; 이승용; 박영태, 2020 한국재료학회 춘.추계통합학술대회, 한국재료학회, 2020-11-19 |
| Investigation of the characteristic changes on the SrTiO3 : Pr,Al,Ga phosphors during the low voltage electron irradiation Kim, JY; You, YC; Jeon, Duk Young; Yu, I; Yang, HG, Proceedings of the 14th International Vacuum Microelectronics Conference, pp.213 - 214, IEEE, 2001-08-12 |
| Investigation of the Electrical Contact Behaviors on RF MEMS Switches Using Nano-Indenter Kim, Dong-Seok; Ko, Seung-Deok; Lee, Byung-Kee; Yoon, Jun-Bo; Kim, Do Kyung, The 11th International Symposium on Nanocomposites and Nanoporous Materials (ISNNM11), The Korean Powder Metallurgy Institute, KAIST Institute for the NanoCentury (KINC), Nano Center for Fine Chemicals Fusion Technology (Inha Univ), 2010-12-02 |
| Investigation of the Electrochemical Properties of Lithium Chloride Layer Formed on the Porous Carbon Cathode during Discharge of Li/SOCl2 Batteries 변수일, The Korean Electrochemical Society, pp.37 - 37, 2002 |
| Investigation of the Kinetics of the Isothermal peritectoid Formation of Corrosion Resistant Zr3Al and U3Si Intermetallic Compounds. 변수일, Korean Corros. Sci. Soc., pp.258 - 267, 1991 |
| Investigation of UBM Systems for Electroplated Sn/37Pb and Sn/3.5Ag Solder Bumps Jang, SY; Jurgen Wolf; Oswin Ehrmann; Heinz Gloor; Herbert Reichl; Paik, Kyung-Wook, MicroSystem Technologies, MicroSystem Technologies, 2001-03-27 |
| Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.950 - 956, Electronic Components and Technology Conference, 2001-05-29 |
| Investigation of Ultra-High Temperature Stability of C/SiC-UHTC Composite via Oxyacetylene Torch Test 공정훈; 김도경; 김동규, 2020 한국재료학회 춘.추계통합학술대회, 한국재료학회, 2020-11-18 |
| Investigation of various microstructure for Alx(FeCoCrMn)1-x high entropy alloys Jung, Chanwon; Choi, Pyuck-Pa, The 3rd East-Asia Microscopy Conference, Korean Society of Microscopy, 2017-11-08 |
| Investigation of various photo-patternable adhesive materials and their processing conditions for MEMS sensor wafer bonding Kim, J; Kim, I; Paik, Kyung-Wook, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1839 - 1846, ECTC, 2011-05-31 |
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