Investigation of various photo-patternable adhesive materials and their processing conditions for MEMS sensor wafer bonding

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 404
  • Download : 0
Publisher
ECTC
Issue Date
2011-05-31
Language
ENG
Citation

2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1839 - 1846

ISSN
0569-5503
URI
http://hdl.handle.net/10203/165734
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0