Polyetherimide 접착제의 표면 처리에 따른 MCM-D 계면 접착력 및 고온고습 신뢰성 변화에 관한 연구A study on the effect of polyetherimide surface treatment on the adhesion and high temperature/high humidity reliability of MCM-D interface
- Advisors
- 백경욱researcher; Paik, Kyung-Wookresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1999
- Identifier
- 156250/325007 / 000973452
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 1999.8, [ iv, 38 p. ]
- Keywords
접착; 필테스트; 폴리에테르이미드; 멀티칩모듈; 표면처리; Surface treatment; Adhesion; Peel test; Polyetherimide; MCM
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.