Polyetherimide 접착제의 표면 처리에 따른 MCM-D 계면 접착력 및 고온고습 신뢰성 변화에 관한 연구A study on the effect of polyetherimide surface treatment on the adhesion and high temperature/high humidity reliability of MCM-D interface
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 백경욱 | - |
| dc.contributor.advisor | Paik, Kyung-Wook | - |
| dc.contributor.author | 윤현국 | - |
| dc.contributor.author | Yoon, Hyun-Gook | - |
| dc.date.accessioned | 2011-12-15T01:32:31Z | - |
| dc.date.available | 2011-12-15T01:32:31Z | - |
| dc.date.issued | 1999 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=156250&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50753 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 1999.8, [ iv, 38 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 접착 | - |
| dc.subject | 필테스트 | - |
| dc.subject | 폴리에테르이미드 | - |
| dc.subject | 멀티칩모듈 | - |
| dc.subject | 표면처리 | - |
| dc.subject | Surface treatment | - |
| dc.subject | Adhesion | - |
| dc.subject | Peel test | - |
| dc.subject | Polyetherimide | - |
| dc.subject | MCM | - |
| dc.title | Polyetherimide 접착제의 표면 처리에 따른 MCM-D 계면 접착력 및 고온고습 신뢰성 변화에 관한 연구 | - |
| dc.title.alternative | A study on the effect of polyetherimide surface treatment on the adhesion and high temperature/high humidity reliability of MCM-D interface | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 156250/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000973452 | - |
| dc.contributor.localauthor | 백경욱 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.