(A) study on the polymer dielectric layer formation and metal/polymer via interconnection in MCM-D substrate fabrication = MCM-D 기판 제조용 폴리머 절연층 형성과 금속/폴리머 비아 접속에 관한 연구

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Advisors
Paik, Kyung-Wookresearcher백경욱researcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
2001
Identifier
165791/325007 / 000965024
Language
eng
Description

학위논문(박사) - 한국과학기술원 : 재료공학과, 2001.2, [ vii, 83 p. ]

Keywords

three dimensional packaging; O2 plasma RIE; polymer adhesion to ceramic; Multilayer MCM-D; aluminum chelate; 킬레이트; 3차원 패키징; 산소 플라즈마; 세라믹-폴리머 접착력; 다층 구조 기판

URI
http://hdl.handle.net/10203/50416
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=165791&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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