(A) study on the polymer dielectric layer formation and metal/polymer via interconnection in MCM-D substrate fabricationMCM-D 기판 제조용 폴리머 절연층 형성과 금속/폴리머 비아 접속에 관한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | Paik, Kyung-Wook | - |
| dc.contributor.advisor | 백경욱 | - |
| dc.contributor.author | Ko, Hyoung-Soo | - |
| dc.contributor.author | 고형수 | - |
| dc.date.accessioned | 2011-12-15T01:06:55Z | - |
| dc.date.available | 2011-12-15T01:06:55Z | - |
| dc.date.issued | 2001 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=165791&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50416 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 재료공학과, 2001.2, [ vii, 83 p. ] | - |
| dc.language | eng | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | three dimensional packaging | - |
| dc.subject | O2 plasma RIE | - |
| dc.subject | polymer adhesion to ceramic | - |
| dc.subject | Multilayer MCM-D | - |
| dc.subject | aluminum chelate | - |
| dc.subject | 킬레이트 | - |
| dc.subject | 3차원 패키징 | - |
| dc.subject | 산소 플라즈마 | - |
| dc.subject | 세라믹-폴리머 접착력 | - |
| dc.subject | 다층 구조 기판 | - |
| dc.title | (A) study on the polymer dielectric layer formation and metal/polymer via interconnection in MCM-D substrate fabrication | - |
| dc.title.alternative | MCM-D 기판 제조용 폴리머 절연층 형성과 금속/폴리머 비아 접속에 관한 연구 | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 165791/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000965024 | - |
| dc.contributor.localauthor | Ko, Hyoung-Soo | - |
| dc.contributor.localauthor | 고형수 | - |
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