무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구 = Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMs

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Advisors
백경욱researcherPaik, Kyung-Wookresearcher
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2004
Identifier
240664/325007  / 020005278
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 신소재공학과, 2004.8, [ xiii, 171 p. ]

Keywords

UBM; INTERFACIAL REACTION; SNAGCU ATION; PB-FREE SOLDER; ELECTROLESS NI; FLIP-CHIP; 계면반응; 하부금속층; 무연 솔더; 무전해 니켈; 플립칩

URI
http://hdl.handle.net/10203/49810
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=240664&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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