무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMs
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 백경욱 | - |
| dc.contributor.advisor | Paik, Kyung-Wook | - |
| dc.contributor.author | 전영두 | - |
| dc.contributor.author | Jeon, Young-Doo | - |
| dc.date.accessioned | 2011-12-15 | - |
| dc.date.available | 2011-12-15 | - |
| dc.date.issued | 2004 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=240664&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/49810 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 신소재공학과, 2004.8, [ xiii, 171 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | UBM | - |
| dc.subject | INTERFACIAL REACTION | - |
| dc.subject | SNAGCU ATION | - |
| dc.subject | PB-FREE SOLDER | - |
| dc.subject | ELECTROLESS NI | - |
| dc.subject | FLIP-CHIP | - |
| dc.subject | 계면반응 | - |
| dc.subject | 하부금속층 | - |
| dc.subject | 무연 솔더 | - |
| dc.subject | 무전해 니켈 | - |
| dc.subject | 플립칩 | - |
| dc.title | 무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구 | - |
| dc.title.alternative | Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMs | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 240664/325007 | - |
| dc.description.department | 한국과학기술원 : 신소재공학과, | - |
| dc.identifier.uid | 020005278 | - |
| dc.contributor.localauthor | 전영두 | - |
| dc.contributor.localauthor | Jeon, Young-Doo | - |
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