무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMs

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dc.contributor.advisor백경욱-
dc.contributor.advisorPaik, Kyung-Wook-
dc.contributor.author전영두-
dc.contributor.authorJeon, Young-Doo-
dc.date.accessioned2011-12-15-
dc.date.available2011-12-15-
dc.date.issued2004-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=240664&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/49810-
dc.description학위논문(박사) - 한국과학기술원 : 신소재공학과, 2004.8, [ xiii, 171 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.subjectUBM-
dc.subjectINTERFACIAL REACTION-
dc.subjectSNAGCU ATION-
dc.subjectPB-FREE SOLDER-
dc.subjectELECTROLESS NI-
dc.subjectFLIP-CHIP-
dc.subject계면반응-
dc.subject하부금속층-
dc.subject무연 솔더-
dc.subject무전해 니켈-
dc.subject플립칩-
dc.title무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구-
dc.title.alternativeStudies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMs-
dc.typeThesis(Ph.D)-
dc.identifier.CNRN240664/325007 -
dc.description.department한국과학기술원 : 신소재공학과, -
dc.identifier.uid020005278-
dc.contributor.localauthor전영두-
dc.contributor.localauthorJeon, Young-Doo-
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MS-Theses_Ph.D.(박사논문)
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