Execution system of the simulator of integrated single-wafer processing tools = 매엽식 반도체 통합제조장비 시뮬레이터의 동적 실행 방법

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 254
  • Download : 0
Semiconductor manufacturing includes dynamic process variation such as machine failure, hot-run, and an operation time variation. The dynamic process variation is one of major causes of throughput decrease, degradation of wafer quality, and inefficient utilization of raw material. Wafer processing by integrated single-wafer processing tools has become a prevalent manufacturing methodology in recent semiconductor industry. This thesis presents two effective methods that can manage the dynamic process variation of the integrated single-wafer processing tools for performance improvement of the tools, and the presented methods are integrated into the simulator of the tools. One method manages contingency such as machine failure and hot-run. Wafers under processes can be continuously progressed despite of an occurrence of the contingency by this method. The other method manages an operation time variation caused by noise and APC (Advanced Process Control). This method is to regulate a pre-calculated schedule, which makes it possible for the schedule to be executed despite an environment where an operation time varies. The two presented methods are integrated into execution system of the simulator. The execution system of the simulator is a module component that acts such as line-MES (Manufacturing Execution System) in real semiconductor manufacturing. The execution system including the presented methods is evaluated through simulations. Operable wafers under processes are progressed after an occurrence of machine failure and hot-run. A pre-calculated schedule including a schedule from an advanced scheduling algorithm is executed by regulating the schedule, when an operation time varies. The number of a rescheduling decreases considerably. The presented methods that manage dynamic process variation can increase throughput of the tools, quality of wafers, and utilization efficiency of raw material. The improvement of performances is verified through the simulations. ...
Lee, Doo-Yongresearcher이두용researcher
한국과학기술원 : 기계공학전공,
Issue Date
243631/325007  / 020033946

학위논문(석사) - 한국과학기술원 : 기계공학전공, 2005.2, [ ix, 78 p. ]


Low Mach Number Asymptotic Analysis; Dynamic Process Variation; Integrated Single-Wafer Processing Tools; Cancellation Error flow analysis of 100W-stack; 소거 오차시간지연분석법반응에 관한 연구?발광 물질; 저마하수 점근 해석; 동적 공정 변화보정; 매엽식 반도체 통합제조장비

Appears in Collection
Files in This Item
There are no files associated with this item.


  • mendeley


rss_1.0 rss_2.0 atom_1.0