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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; Bae, Michael, DesignCon 2016, DesignCon 2016, 2016-01-19 | |
| Estimation and Analysis of Crosstalk Effects in High-Bandwidth Memory Channel Choi, Sumin; Kim, Heegon; Park, Junyong; Kim, Dong-Hyun; Jung, Daniel H; Lim, Jaemin; Cho, Kyungjun; Kim, Joungho, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.4 - 4, IEEE EMC & APEMC, 2018-05-16 | |
| Modeling and Analysis of High-Speed Through Silicon Via (TSV) Channel and Defects Jung, Daniel H; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Bae, Hyun-Cheol; Choi, Kwang-Seong, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.430 - 433, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Kim, Sukjin; Bae, Bumhee; Jung, Daniel H; Kong, Sunkyu; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.158 - 162, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure Jung, Daniel H; Kim, Joohee; Kim, Heegon; Kim, Jonghoon J; Kim, Joungho; Pak, Jun So, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23 | |
| Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Jung, Daniel H; Kim, Jonghoon J; Choi, Sumin; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.5 - 9, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| A Fast Statistical Eye-diagram Estimation Method including Internal PDN Noise of Pseudo-differential Receiver Buffer Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Jonghoon J; Jung, Daniel H; Lee, Hyunuk; Cho, Kyungjun, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2015-12-15 | |
| Design of Crosstalk Compensation Passive Equalizers for High-speed Differential Signaling on 2.5D-IC Interposer Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Sukjin; Jung, Daniel H; Lee, Junho; Park, Kunwoo, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium , pp.253 - 256, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium, 2013-12-13 | |
| Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |