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Results 21-30 of 30 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB Pak, J.S.; Kim, J.; Lee, H.; Byun, J.-G.; Kim, Joungho, 2003 IEEE Symposium on Electromagnetic Compatibility, pp.231 - 235, IEEE, 2003-08-18 | |
| Active circuit to through silicon via (TSV) noise coupling Cho, J.; Shim, J.; Song, E.; Pak, J.S.; Lee, J.; Lee, H.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.97 - 100, IEEE, 2009-10-19 | |
| Sharing power distribution networks for enhanced power integrity by using through-silicon-via Pak, J.S.; Kim, Joungho; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10 | |
| Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01 | |
| PCB power/ground plane edge radiation excited by high-frequency clock Pak, J.S.; Kim, H.; Kim, Joungho; Lee, H., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.197 - 202, IEEE, 2004-08-09 | |
| Unit cell modeling of meander delay line based on finite-difference time-domain method and Floquet's theorem Lee, H.; Kim, N.; Kim, Joungho, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.193 - 196, IEEE, 2001-10-29 | |
| Modified Yee's Cell for finite-difference time-domain modeling of periodic boundary guiding structure Lee, H.; Kim, Joungho, International Microwave Symposium Digest IEEE-MTT-S 2001, pp.889 - 892, IEEE, 2001-05-20 | |
| Experimental investigation of radiated emission from flexible printed circuit (FPC) cable Ahn, S.; Kim, J.; Lee, H.; Kim, Joungho; Byun, J.-G.; Choi, C.-S.; Hwang, H.-J., IEEE International Symposium on Electromagnetic Compatibility, 2002, pp.883 - 888, IEEE, 2002-08-19 | |
| Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB Kam, D.G.; Lee, H.; Baek, S.; Park, B.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, 2002, pp.643 - 647, IEEE, 2002-08-19 | |
| Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane Lee, H.; Kim, H.; Kim, Joungho; Jeong, Y.C.; Kim, J., IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2001, pp.145 - 148, IEEE, 2001-10-29 |
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