Sharing power distribution networks for enhanced power integrity by using through-silicon-via

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Publisher
IEEE
Issue Date
2008-12-10
Language
ENG
Citation

2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12

URI
http://hdl.handle.net/10203/18888
Appears in Collection
EE-Conference Papers(학술회의논문)
Files in This Item
[Pub-08..12.12]EDAPS08_Jun_So_Pak.pdf(923.61 kB)Download

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