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Results 21-30 of 46 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
21
A precise analytical eye-diagram estimation method for non-ideal high-speed channels

Cho, J.; Song, E.; Shim, J.; Kim, J.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.159 - 162, IEEE, 2009-10-19

22
Analytical modeling of power distribution network with embedded electromagnetic bandgap structure

Hwang, C.; Kim, J.; Shim, Y.; Kim, Joungho, 2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009, pp.69 - 73, IEEE, 2009-08-17

23
Compensation of undesired channel effects by frequency domain optimization of pre-emphasis filter for over gbps signaling

Kim, J.; Lee, J.; Song, E.; Jo, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.721 - 726, IEEE, 2006-08-14

24
Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling

Song, E.; Lee, J.; Kim, J.; Kam, D.G.; Ryu, C.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.741 - 746, IEEE, 2006-09-05

25
Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB

Pak, J.S.; Kim, J.; Lee, H.; Byun, J.-G.; Kim, Joungho, 2003 IEEE Symposium on Electromagnetic Compatibility, pp.231 - 235, IEEE, 2003-08-18

26
Design and analysis of improved multi-module memory bus using Wilkinson power divider

Kim, J.; Song, E.; Kim, J.; Kim, Joungho; Sung, M.; Kim, J.; So, B., IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.642 - 645, IEEE, 2006-08-14

27
Noise isolation in LTCC-based X/Ku-band transceiver SiP using double-stacked electromagnetic bandgap structure

Park, J.; Kim, J.; Lu A.C.W.; Shim, Y.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09

28
Networks-in-package; design, analysis and implementation

Kim, G.; Lee, K.; Kim, J.; Bae, K.; Lee, C.; Yoo, H.-J.; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, pp.221 - 224, IEEE, 2006-10-23

29
Sharing power distribution networks for enhanced power integrity by using through-silicon-via

Pak, J.S.; Kim, Joungho; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10

30
Mode-impedance method for modeling and analysis of crosstalk in differential meander delay lines

Kim, G.; Kim, J.; Lee, S.; Kim, J.; Kim, Joungho, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.93 - 96, IEEE, 2008-12-10

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