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Results 11-20 of 22 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High frequency electrical model of through wafer via for 3-D stacked chip packaging Ryu, C.; Lee, J.; Lee, H.; Lee, K.; Oh, T.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.215 - 220, IEEE, 2006-09-05 | |
| Analysis of the effect of AC noise on DC bias of VGA for UHF RFID using chip-package co-modeling and simulation Lee, H.; Shim, Y.; Park, H.; Ryu, C.; Yoon, C.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.591 - 594, IEEE, 2007-12-12 | |
| Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator Yoon, C.; Lee, J.; Kim, M.; Park, Y.; Park, H.; Lee, H.; Kim, Joungho, 8th Electronics Packaging Technology Conference, EPTC 2006, pp.85 - 89, IEEE, 2006-12-06 | |
| Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB Pak, J.S.; Kim, J.; Lee, H.; Byun, J.-G.; Kim, Joungho, 2003 IEEE Symposium on Electromagnetic Compatibility, pp.231 - 235, IEEE, 2003-08-18 | |
| Active circuit to through silicon via (TSV) noise coupling Cho, J.; Shim, J.; Song, E.; Pak, J.S.; Lee, J.; Lee, H.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.97 - 100, IEEE, 2009-10-19 | |
| Sharing power distribution networks for enhanced power integrity by using through-silicon-via Pak, J.S.; Kim, Joungho; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10 | |
| PCB power/ground plane edge radiation excited by high-frequency clock Pak, J.S.; Kim, H.; Kim, Joungho; Lee, H., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.197 - 202, IEEE, 2004-08-09 | |
| Unit cell modeling of meander delay line based on finite-difference time-domain method and Floquet's theorem Lee, H.; Kim, N.; Kim, Joungho, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.193 - 196, IEEE, 2001-10-29 | |
| Modified Yee's Cell for finite-difference time-domain modeling of periodic boundary guiding structure Lee, H.; Kim, Joungho, International Microwave Symposium Digest IEEE-MTT-S 2001, pp.889 - 892, IEEE, 2001-05-20 | |
| Experimental investigation of radiated emission from flexible printed circuit (FPC) cable Ahn, S.; Kim, J.; Lee, H.; Kim, Joungho; Byun, J.-G.; Choi, C.-S.; Hwang, H.-J., IEEE International Symposium on Electromagnetic Compatibility, 2002, pp.883 - 888, IEEE, 2002-08-19 |