Browse "EE-Conference Papers(학술회의논문)" by Author Sim, Boogyo
Showing results 1 to 20 of 20
| A deep neural network-based estimation of efficiency enhancement by an intermediate coil in automotive wireless power transfer system Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Lee, Seongsoo; Jeong, Seung Taek; Kim, Hongseok; Park, Hyunwook; et al, 2020 IEEE Wireless Power Transfer Conference, WPTC 2020, pp.231 - 233, Institute of Electrical and Electronics Engineers Inc., 2020-11 |
| A Deep Neural Network-based Estimation of EMI Reduction by an Intermediate Coil in Automotive Wireless Power Transfer System Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Park, Hyunwook; Kang, Hyungmin; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.407 - 410, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| A Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling Kim, Keunwoo; Lee, Junghyun; Hong, Seokwoo; Kim, Hyunwoo; Sim, Boogyo; Son, Kyungjune; Shin, Taein; et al, 31st IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-10 |
| A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM) Son, Keeyoung; Kim, Subin; Park, Hyunwook; Kim, Seongguk; Kim, Keunwoo; Park, Shinyoung; Sim, Boogyo; et al, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 |
| Analytical Expressions of Differential-mode Harmonics in Loosely-coupled Series-resonant Wireless Power Transfer System Kim, Hongseok; Fan, Jun; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.648 - 653, Institute of Electrical and Electronics Engineers Inc., 2019-07 |
| Cochlear implant wireless power transfer system design for high efficiency and link gain stability using a proposed stagger tuning method Hong, Seokwoo; Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Kim, Hongseok; Lee, Hoseung; Ahn, Woojin; et al, IEEE Wireless Power Transfer Conference, WPTC 2020, pp.26 - 29, Institute of Electrical and Electronics Engineers Inc., 2020-11 |
| Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling Kim, Keunwoo; Lho, Daehwan; Park, Hyunwook; Son, Keeyoung; Kim, Seongguk; Park, Shinyoung; Sim, Boogyo; et al, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 |
| Core-Shared-Repeater (CSR) Coil Scheme for Low EMI and Efficient WPT System in Ultra-Thin Digital TV Kim, Joungho; Sim, Boogyo; Jeong, Seungtaek; Song, Chiuk; Lee, Seongsoo; Hong, Seokwoo; Song, Jinwook, IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018), IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018), 2018-06-05 |
| Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve Lho, Daehwan; Park, Hyunwook; Kim, Seongguk; Shin, Taein; Kim, Keunwoo; Son, Kyungjune; Kang, Hyungmin; et al, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
| Design and Analysis of EMI Shielding Method using Intermediate Coil for Train WPT System Lee, Seongsoo; Jeong, Seungtaek; Hong, Seokwoo; Sim, Boogyo; Kim, Joungho, IEEE MTT-S Wireless Power Transfer Conference(WPTC 2018), IEEE MTT-S Wireless Power Transfer Conference(WPTC 2018), 2018-06-05 |
| Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs Kim, Subin; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Park, Hyunwook; Kim, Haeyeon; Kim, Joungho, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.498 - 503, IEEE, 2021-07-26 |
| Design, simulation and measurement of a flexible voltage-controlled oscillator (VCO) chip with bending radius Jeong, Seungtaek; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Park, Hyunwook; Kim, Subin; Kim, Youngwoo; et al, IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), IEEE, 2020-10 |
| Design, Simulation and Measurement of Flexible PCB Coils for Wearable Device Wireless Power Transfer Jeong, Seungtaek; Song, Jinwook; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Kim, Hongseok; Kim, Subin; et al, IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018), IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018), 2018-06-05 |
| Deterministic Policy Gradient-based Reinforcement Learning for DDR5 Memory Signaling Architecture Optimization considering Signal Integrity Lho, Daehwan; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, Boogyo; Son, Kyungjune; Son, Keeyoung; et al, 31st IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-10 |
| High Efficiency Wireless Power Transfer System using a Two-stack Hybrid Metamaterial Slab Lee, Seongsoo; Cho, Yeonje; Jeong, Seung Taek; Hong, Seokwoo; Sim, Boogyo; Kim, Hongseok; Kim, Joungho, 2019 IEEE Wireless Power Transfer Conference, WPTC 2019, pp.616 - 619, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip Shin, TaeIn; Son, Kyungjune; Kim, Seongguk; Cho, Kyungjun; Park, Shinyoung; Kim, Subin; Park, Gapyeol; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Low EMF Design of Cochlear Implant Wireless Power Transfer System using A Shielding Coil Hong, Seokwoo; Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Kim, Hongseok; Kim, Joungho, 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.623 - 625, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| Modeling, simulation and measurement of on-chip interconnects with extremely thin Si substrate for flexible electronics Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Hong, Seokwoo; Park, Hyunwook; Kim, Subin; Kim, Joungho; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Noise coupling analysis method for an electronic safety and arming device (ESAD) Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) Systems Das, Mumpy; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Hong, Seokwoo; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 |
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