Browse "EE-Conference Papers(학술회의논문)" by Author Park, Hyunwook
Showing results 1 to 56 of 56
| A deep neural network-based estimation of efficiency enhancement by an intermediate coil in automotive wireless power transfer system Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Lee, Seongsoo; Jeong, Seung Taek; Kim, Hongseok; Park, Hyunwook; et al, 2020 IEEE Wireless Power Transfer Conference, WPTC 2020, pp.231 - 233, Institute of Electrical and Electronics Engineers Inc., 2020-11 |
| A Deep Neural Network-based Estimation of EMI Reduction by an Intermediate Coil in Automotive Wireless Power Transfer System Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Park, Hyunwook; Kang, Hyungmin; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.407 - 410, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| A New Challenge for Neuromorphic Computing System: from Off-chip Interconnects to On-chip Interconnects Park, Hyunwook; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Son, Keeyoung, DesignCon 2022, IEEE, 2022-04-05 |
| A New Design Method of GDDR6 WCLK Using Reinforcement Learning for over 20Gbps Park, Hyunwook; Kim, Joungho; Cho, Kyungjun; Sim, BooGyo; Kim, Subin; Jeong, Seung Taek, DesignCon 2021, IEEE, 2021-08-16 |
| A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM) Son, Keeyoung; Kim, Subin; Park, Hyunwook; Kim, Seongguk; Kim, Keunwoo; Park, Shinyoung; Sim, Boogyo; et al, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 |
| A Processing-In-Memory on High Bandwidth Memory (PIM-HBM): Impact of interconnect Channels on System Performance in 2.5D/3D IC Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Park, Joonsang, DesignCon 2022, IEEE, 2022-04-05 |
| An Induction Heating System Analysis Method based on Operating Conditions Kang, Hyungmin; Lho, Daehwan; Park, Hyunwook; Kong, Taewoong; Choi, Hyojin; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.478 - 481, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis Lho, Daehwan; Park, Junyong; Park, Hyunwook; Park, Shinyoung; Kim, SeongGuk; Kang, Hyungmin; Kim, Subin; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling Kim, Keunwoo; Lho, Daehwan; Park, Hyunwook; Son, Keeyoung; Kim, Seongguk; Park, Shinyoung; Sim, Boogyo; et al, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 |
| Crosstalk-included PAM-4 Worst Eye Diagram Estimation Method for High-speed Serial Links Park, Hyunwook; Kim, Joungho; Kim, Keunwoo; Sim, BooGyo; Lho, Daehwan; Shin, TaeIn; Son, Keeyoung; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve Lho, Daehwan; Park, Hyunwook; Kim, Seongguk; Shin, Taein; Kim, Keunwoo; Son, Kyungjune; Kang, Hyungmin; et al, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
| Deep Reinforcement Learning Framework for Optimal Decoupling Capacitor Placement on General PDN with an Arbitrary Probing Port Kim, Haeyeon; Kim, Joungho; Park, Hyunwook; Choi, Seonguk; Park, Joonsang; Kim, SeongGuk, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Kim, Haeyeon; Park, Joonsang; Son, Keeyoung; Kim, SeongGuk; et al, DesignCon 2022, DesignCon, 2022-04-07 |
| Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity Son, Kyungjune; Kim, Minsu; Park, Hyunwook; Park, Shinyoung; Park, Gap Yeol; Lho, Daewhan; Kim, Seoungguk; et al, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
| Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation Park, Joonsang; Kim, Joungho; Kim, SeongGuk; Son, Keeyoung; Shin, TaeIn; Park, Hyunwook; Choi, Seonguk; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Deep Reinforcement Learning-based through Silicon Via (TSV) Array Design Optimization Method considering Crosstalk Kim, Keunwoo; Park, Hyunwook; Lho, Daehwan; Kim, Minsu; Son, Keeyoung; Son, Kyungjune; Kim, Seongguk; et al, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
| Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box Son, Kyungjune; Choi, Sumin; Jung, Daniel Hyunsuk; Kim, Keunwoo; Park, Gapyeol; Lho, Daehwan; Park, Hyunwook; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module Kim, Hyunwoo; Park, Joonsang; Son, Keeyoung; Kim, Joungho; Kim, Haeyeon; Park, Hyunwook; Shin, TaeIn; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Design and analysis of high-definition multimedia interface connectors considering signal integrity Kumar, Gaurav; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Park, Junyong; Kim, Joungho; Lee, Junho; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 |
| Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs Kim, Subin; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Park, Hyunwook; Kim, Haeyeon; Kim, Joungho, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.498 - 503, IEEE, 2021-07-26 |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 |
| Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
| Design, simulation and measurement of a flexible voltage-controlled oscillator (VCO) chip with bending radius Jeong, Seungtaek; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Park, Hyunwook; Kim, Subin; Kim, Youngwoo; et al, IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), IEEE, 2020-10 |
| Deterministic Policy Gradient-based Reinforcement Learning for DDR5 Memory Signaling Architecture Optimization considering Signal Integrity Lho, Daehwan; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, Boogyo; Son, Kyungjune; Son, Keeyoung; et al, 31st IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-10 |
| Deterministic Policy-based Reinforcement Learning Method for Optimization method Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, BooGyo; Son, Kyungjune; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11 |
| Electrical performance comparison between coaxial and non-coaxial silicone rubber socket Park, Junyong; Ha, Dongho; Shin, Taein; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.293 - 296, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Eye-width and Eye-height Estimation Method based on Artificial Neural Network (ANN) for USB 3.0 Lho, Daehwan; Park, Junyong; Park, Hyunwook; Kang, Hyungmin; Park, Shinyoung; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.209 - 211, IEEE, 2018-10-15 |
| Imitate Expert Policy and Learn Beyond: A Practical PDN Optimizer by Imitation Learning Choi, Seonguk; Kim, Joungho; Park, Joonsang; Son, Keeyoung; Park, Hyunwook, DesignCon 2022, IEEE, 2022-04-05 |
| Imitation Learning for Simultaneous Escape Routing Kim, Minsu; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Kim, Haeyeon; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Imitation Learning with Bayesian Exploration (IL-BE) for Signal Integrity (SI) of PAM-4 based High-speed Serial Link: PCIe 6.0 Kim, Jihun; Kim, Joungho; Park, Hyunwook; Yoon, Jiwon; Choi, Seonguk; Park, Joonsang; Kim, HaeYeon; et al, DesignCon 2022, DesignCon, 2022-04-05 |
| Intra-pair Skew Impact Analysis of High-speed Cables for HDMI Interface Sim, BooGyo; Kim, Joungho; Kim, Keunwoo; Shin, TaeIn; Park, Hyunwook; Kim, SeongGuk; Lho, Daehwan; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-10 |
| Learning Super-scale Microbump Pin Assignment Optimization for Real-world PCB Design with Graph Representation Park, Joonsang; Kim, Joungho; Choi, Seonguk; Kim, Haeyeon; Park, Hyunwook; Kim, SeongGuk; Shin, TaeIn, DesignCon 2022, IEEE, 2022-04-05 |
| Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface Shin, TaeIn; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Son, Keeyoung; Park, Gap Yeol; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
| Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity Shin, Taein; Park, Shinyoung; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Kim, Subin; Son, Kyungjune; et al, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.417 - 421, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 |
| Modeling, simulation and measurement of on-chip interconnects with extremely thin Si substrate for flexible electronics Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Hong, Seokwoo; Park, Hyunwook; Kim, Subin; Kim, Joungho; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Neural Language Model Enables Extremely Fast and Robust Routing on Interposer Kim, Minsu; Kim, Joungho; Park, Hyunwook; Choi, Seonguk; Kim, Haeyeon; Kim, SeongGuk; Son, Keeyoung; et al, Designcon 2021, IEEE, 2021-08-17 |
| Noise coupling analysis method for an electronic safety and arming device (ESAD) Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization Kim, Jihun; Kim, Joungho; Park, Hyunwook; Kim, SeongGuk; Choi, Seonguk; Son, Keeyoung; Park, Joonsang; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network Park, Hyunwook; Kim, Minsu; Kim, Subin; Jeong, Seungtaek; Kim, Seongguk; Kang, Hyungmin; Kim, Keunwoo; et al, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
| Power Distribution Network Impedance Analysis considering Thermal Distribution Son, Keeyoung; Kim, Joungho; Lho, Daehwan; Kim, Keunwoo; Choi, Seonguk; Kim, Haeyeon; Park, Hyunwook; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Power integrity comparison of off-chip, on-interposer, on-chip voltage regulators in 2.5D/3D ICs Kim, Subin; Cho, Kyungjun; Park, Shinyoung; Park, Hyunwook; Kim, Seongguk; Jeong, Seungtaek; Son, Kyungjune; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Reinforcement Learning-based Auto-router considering Signal Integrity Kim, Minsu; Park, Hyunwook; Kim, Seongguk; Son, Keeyoung; Kim, Subin; Son, Kyunjune; Choi, Seonguk; et al, 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020, IEEE, 2020-10 |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 |
| Scalable Transformer Network-based Reinforcement Learning Method for PSIJ Optimization in HBM Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Kim, SeongGuk; Lho, Daehwan; Sim, BooGyo; Song, Jinwook; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-10 |
| Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Park, Joonsang; Kim, Haeyeon; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Signal Integrity Analysis of High Speed Channel considering Thermal Distribution Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Park, Hyunwook; Park, Gap Yeol, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning Son, Kyungjune; Kim, Joungho; Kim, Keunwoo; Park, Gap Yeol; Lho, Daehwan; Park, Hyunwook; Sim, BooGyo; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11 |
| Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics Park, Hyunwook; Kim, Joungho; Park, Joonsang; Park, Gap Yeol; Lho, Daehwan; Sim, BooGyo; Kang, Hyungmin; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
| Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM) Kim, SeongGuk; Kim, Joungho; Shin, TaeIn; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
| Statistical Analysis of Simultaneous Switching Output (SSO) Impacts on Steady State Output Responses and Signal Integrity Kim, Youngwoo; Fujimoto, Daisuke; Nishiyama, Hikaru; Hayashi, Yu-Ichi; Lho, Daehwan; Park, Hyunwook; Kim, Joungho, 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019, pp.138 - 140, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Park, Hyunwook; Shin, TaeIn; Choi, Seonguk; et al, DesignCon 2022, IEEE, 2022-04-07 |
| Wireless Memory Test: A Breakthrough Solution for Highly Reliable HBM Park, Hyunwook; Kim, Joungho; Kim, Subin; Kim, SeongGuk; Jeong, Seung Taek; Park, Gap Yeol, Designcon 2021, IEEE, 2021-08-17 |
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