Browse "EE-Conference Papers(학술회의논문)" by Author Jung, Daniel H
Showing results 1 to 16 of 16
| A Fast Statistical Eye-diagram Estimation Method including Internal PDN Noise of Pseudo-differential Receiver Buffer Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Jonghoon J; Jung, Daniel H; Lee, Hyunuk; Cho, Kyungjun, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2015-12-15 |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; et al, DesignCon 2016, DesignCon 2016, 2016-01-19 |
| Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Jung, Daniel H; Kim, Jonghoon J; Choi, Sumin; Lee, Junho; et al, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.5 - 9, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Kim, Sukjin; Bae, Bumhee; Jung, Daniel H; Kong, Sunkyu; et al, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.158 - 162, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Design of Crosstalk Compensation Passive Equalizers for High-speed Differential Signaling on 2.5D-IC Interposer Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Sukjin; Jung, Daniel H; Lee, Junho; Park, Kunwoo, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium , pp.253 - 256, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium, 2013-12-13 |
| Design, Implementation and Measurement of Board-to-Board Wireless Power Transfer (WPT) for Low Voltage Applications Kim, Joungho; Kim, Sukjin; Bae, Bumhee; Kong, Sunkyu; Jung, Daniel H; Kim, Jonghoon J, 22nd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2013), 22nd Conference on Electrical Performance of Electronic Packaging and Systems, 2013-10-29 |
| Electromagnetic noise effects on semiconductor system in electric vehicle Bae, Bumhee; Kim, Jonghoon J; Kim, Sukjin; Kong, Sunkyu; Jung, Daniel H; Kim, Joungho, DesignCon 2015, UBM Electronics, 2015-01 |
| Estimation and Analysis of Crosstalk Effects in High-Bandwidth Memory Channel Choi, Sumin; Kim, Heegon; Park, Junyong; Kim, Dong-Hyun; Jung, Daniel H; Lim, Jaemin; Cho, Kyungjun; et al, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.4 - 4, IEEE EMC & APEMC, 2018-05-16 |
| Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure Jung, Daniel H; Kim, Joohee; Kim, Heegon; Kim, Jonghoon J; Kim, Joungho; Pak, Jun So, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23 |
| Harmonic Current Reduction Method of Hand-Held Resonant Magnetic Field Charger (HH-RMFC) for Electric Vehicle Kim, Joung-Ho; Song,Chiuk; Kim,Hongseok; Jung, Daniel H; Song,Eunseok; Kim,Sukjin; Kim,jonghoon, 2014 International Symposium on Electromagnetic Compatability, Tokyo, 2014 International Symposium on Electromagnetic Compatability, Tokyo, 2014-05-13 |
| High-frequency TSV Failure Detection Method with Z parameter Kim, Joohee; Jung, Daniel H; Chok, Jonghyun; Pak, Jun So; Yook, Jong Min; Kim, Jun Chul; Kim, Joungho, IEEE 38th International symposium of Test and Failure Analysis (ISTFA), IEEE, 2012-11 |
| Leakage Magnetic Field Reduction Method using High Q Multiple Resonant Reactive Loop Shielding in Three-phase Resonant WPT Charger for Drone Song, Chiuk; Kim, Joungho; Jung, Daniel H; Kim, Jonghoon J; Cho, Yeonje; Kong, Sunkyu; Jo, Kyoungyoung; et al, IEEE Transportation Electrification, IEEE Transportation Electrification, 2016-06-02 |
| Modeling and Analysis of High-Speed Through Silicon Via (TSV) Channel and Defects Jung, Daniel H; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Bae, Hyun-Cheol; et al, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.430 - 433, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
| Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Modeling, Measurement, and Analysis of TSV Channel and Defects for 2.5D/3D IC Failure Analysis Kim, Joungho; Jung, Daniel H; Bae, Hyun-Cheol; Choi, Kwang-Seong; Youn, Joong Suk, DesignCon 2017, DesignCon 2017, 2017-02-01 |
| Structure of Handheld Resonant Magnetic Coupling Charger (HH-RMCC) for Electric Vehicle considering Electromagnetic Field Kim, Joungho; Song, Chiuk; Kim, Hongseok; Kong, Sunkyu; Jung, Daniel H; Kim, In-myoung; Kim, Young-il; et al, Wireless Power Transfer (WPT), 2013 IEEE, 2013-05-15 |
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