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Browse "EE-Conference Papers(학술회의논문)" by Author Hong, J.-K.

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1
Microwave frequency crosstalk model of redistribution line patterns on wafer level package

Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; et al, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29

2
Microwave frequency model of water level package and increased loading effect on rambus memory module

Lee, J.; Choi, B.; Ahn, S.; Ryu, W.; Kim, J.M.; Choi, K.S.; Hong, J.-K.; et al, 51st Electronic Components and Technology Conference, pp.128 - 132, 2001-05-29

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