Browse "EE-Conference Papers(학술회의논문)" by Author Jung, Daniel H

Showing results 9 to 16 of 16

9
Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure

Jung, Daniel H; Kim, Joohee; Kim, Heegon; Kim, Jonghoon J; Kim, Joungho; Pak, Jun So, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23

10
Harmonic Current Reduction Method of Hand-Held Resonant Magnetic Field Charger (HH-RMFC) for Electric Vehicle

Kim, Joung-Ho; Song,Chiuk; Kim,Hongseok; Jung, Daniel H; Song,Eunseok; Kim,Sukjin; Kim,jonghoon, 2014 International Symposium on Electromagnetic Compatability, Tokyo, 2014 International Symposium on Electromagnetic Compatability, Tokyo, 2014-05-13

11
High-frequency TSV Failure Detection Method with Z parameter

Kim, Joohee; Jung, Daniel H; Chok, Jonghyun; Pak, Jun So; Yook, Jong Min; Kim, Jun Chul; Kim, Joungho, IEEE 38th International symposium of Test and Failure Analysis (ISTFA), IEEE, 2012-11

12
Leakage Magnetic Field Reduction Method using High Q Multiple Resonant Reactive Loop Shielding in Three-phase Resonant WPT Charger for Drone

Song, Chiuk; Kim, Joungho; Jung, Daniel H; Kim, Jonghoon J; Cho, Yeonje; Kong, Sunkyu; Jo, Kyoungyoung; et al, IEEE Transportation Electrification, IEEE Transportation Electrification, 2016-06-02

13
Modeling and Analysis of High-Speed Through Silicon Via (TSV) Channel and Defects

Jung, Daniel H; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Bae, Hyun-Cheol; et al, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.430 - 433, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

14
Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel

Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15

15
Modeling, Measurement, and Analysis of TSV Channel and Defects for 2.5D/3D IC Failure Analysis

Kim, Joungho; Jung, Daniel H; Bae, Hyun-Cheol; Choi, Kwang-Seong; Youn, Joong Suk, DesignCon 2017, DesignCon 2017, 2017-02-01

16
Structure of Handheld Resonant Magnetic Coupling Charger (HH-RMCC) for Electric Vehicle considering Electromagnetic Field

Kim, Joungho; Song, Chiuk; Kim, Hongseok; Kong, Sunkyu; Jung, Daniel H; Kim, In-myoung; Kim, Young-il; et al, Wireless Power Transfer (WPT), 2013 IEEE, 2013-05-15

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