Browse "EE-Conference Papers(학술회의논문)" by Type Conference
Showing results 16721 to 16740 of 22800
| Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer Kim, Young Woo; Kim, Ki Yeong; Cho, Jong Hyun; Sundaram, Venky; Tummala, Rao; Kim, Joung Ho, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28 |
| Signal and power integrity design of 2.5D HBM (High bandwidth memory module) on SI interposer Cho, Kyungjun; Lee, Hyunsuk; Kim, Joungho, Pan Pacific Microelectronics Symposium, Pan Pacific 2016, Institute of Electrical and Electronics Engineers Inc., 2016-01 |
| Signal constellation of modulation schemes for CDMA reverse link Ha, Jeongseok, 대한전자공학회, pp.0 - 0, 한국통신학회, 1997-07-01 |
| Signal detection with a uniform quantizer and an input amplitude compressor Kim, J.; Song, Iickho; Cho, S.H., ISITA, pp.291 - 294, 1990-11 |
| Signal detection based on log-likelihood ratio in OFDM systems with frequency offset Chang, K.; Kim, H.; Han, Youngnam, 2004 IEEE 60th Vehicular Technology Conference, VTC2004-Fall: Wireless Technologies for Global Security, v.60, pp.3383 - 3387, IEEE, 2004-09-26 |
| Signal detection using log-likelihood ratio based sorting QR decomposition for V-BLAST systems Lee, HyuckJae; Jeon, H.; Jung, H.; Lee, H., 2007 IEEE 65th Vehicular Technology Conference - VTC2007-Spring, pp.1881 - 1885, IEEE, 2007-04-22 |
| Signal integrity analysis of a super speed pair of a USB 3.0 connector with test Jig Kim, Joungho; Kim, Hyesoo; Park, Shinyoung; Kim, Jonghoon; Park, Jung-Min; Kim, UnHo; Jeon, YuckHwan, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017-12-15 |
| Signal Integrity Analysis of High Speed Channel considering Thermal Distribution Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Park, Hyunwook; Park, Gap Yeol, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Signal Integrity Analysis of High Speed Connector for Multi-Media System Kim, Joungho; Song, Huijin; Kim, Jonghoon; Park, Junyong; Lee, Junho; Choi, Seongmin, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 |
| Signal Integrity Analysis of High-Speed Board-to-Board Floating Connectors for Automotive Systems Kim, Joungho; Park, Shinyoung; Kim, Hyesoo; Kim, Jonghoon; Kim, Unho; Park, Jungmin; Jeon, Yuckhwan, IEEE International Conference on Electrical Performance of Electronic Packaging Systems, IEEE International Conference on Electrical Performance of Electronic Packaging Systems, 2017-10-17 |
| Signal Integrity Analysis of Machine Pressed Coaxial Connector for Automotive System Kim, Joungho; Kim, Dong-Hyun; Lee, Hyunsuk; Kim, Jonghoon; Park, Jung-Min; Kim, Un-ho; Kim, Kun-ho; et al, IEEE International Conference on Electrical Performance of Electronic Packaging Systems 2017, IEEE International Conference on Electrical Performance of Electronic Packaging Systems 2017, 2017-10-18 |
| Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects Choi, Sumin; Park, Junyong; Jung, Daniel H.; Kim, Joungho; Kim, Heegon; Kim, Kiyeong, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2139 - 2144, Electronic Components and Technology Conference 2017, 2017-05-30 |
| Signal integrity analysis of vertical dual port coaxial connector for automotive system Kim, Dong-Hyun; Lee, Hyunsuk; Kim, Hongseok; Kim, Jonghoon; Kim, Joungho; Park, Jung-Min; Kim, Ji-Min; et al, 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016, pp.165 - 167, Institute of Electrical and Electronics Engineers Inc., 2016-10 |
| Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning Son, Kyungjune; Kim, Joungho; Kim, Keunwoo; Park, Gap Yeol; Lho, Daehwan; Park, Hyunwook; Sim, BooGyo; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11 |
| Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics Park, Hyunwook; Kim, Joungho; Park, Joonsang; Park, Gap Yeol; Lho, Daehwan; Sim, BooGyo; Kang, Hyungmin; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
| Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM) Kim, SeongGuk; Kim, Joungho; Shin, TaeIn; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
| Signal Integrity Design of Bump-less Interconnection for High-speed Signaling in 2.5D and 3D IC Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Dong-Hyun; Cho, Kyungjun, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015-05-26 |
| Signal Integrity Design of High-speed Semiconductor Test Probe Card Kim, Jong Hoon; Song, Jin Wook; Lee, Eun Jung; Lee, Man Ho; Park, Jung Keun; Lee, Ji Sun; Kim, Hyun Min; et al, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23 |
| Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC Lee, Hyunsuk; Kim, Joungho; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Cho, Kyungjun; Jeon, Yeseul, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
| Signal Integrity of High Bandwidth Memory (HBM) Interposer Cho, Kyung Jun; Lee, Hyun Suk; Kim, Hee Gon; Choi, Su Min; Lim, Jae Min; Kim, Hyung Soo; Kim, Young Ju; et al, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23 |
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