Signal and power integrity design of 2.5D HBM (High bandwidth memory module) on SI interposer

Abstract

Spurred by the industrial demands for terabyte/s bandwidth graphics module, high bandwidth memory (HBM) has been emerged to overcome the limitations of conventional DRAMs. Additionally, due to the fine pitch and high density interconnect routing between GPU and 4 HBMs in 2.5D terabyte/s bandwidth graphics module, HBM interposer has also been to the force. However, several signal integrity issues of the HBM interposer occur due to the manufacturing process constraints. In this paper, we design the HBM interposer using 6 layers redistribution layer (RDL) and TSVs in 2.5D terabyte/s bandwidth graphics module. And then, in the designed HBM interposer, electrical performance of the HBM interposer channels using M1, M3, and M5 layer is analyzed by simulation in the frequency-and time-domain. With the simulation results, it is observed that the designed HBM interposer shows good signal integrity.