Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC

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Publisher
66th Electronic Components and Technology Conference (ECTC)
Issue Date
2016-05-31
Language
English
Citation

66th Electronic Components and Technology Conference (ECTC)

URI
http://hdl.handle.net/10203/215552
Appears in Collection
EE-Conference Papers(학술회의논문)
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