Method for bonding between electrical devices using ultrasonic vibration초음파진동을 이용한 전기기기의 접합방법
The present invention is to provide a method for bonding between electrical devices, including the steps of: aligning electrodes on a bonded area of an upper electrical device and a lower electrical device to be bonded; and curing of adhesives by applying ultrasonic energy to the adhesives between the upper electrical device and the lower electrical device.
- Assignee
- KAIST
- Country
- CC (Cocos (Keeling) Islands)
- Application Date
- 2006-11-22
- Application Number
- 200680043828.9
- Registration Date
- 2011-04-20
- Registration Number
- ZL200680043828.9
- Appears in Collection
- MS-Patent(특허)
- Files in This Item
- There are no files associated with this item.
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