Method for bonding between electrical devices using ultrasonic vibration초음파진동을 이용한 전기기기의 접합방법
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Yim, Myung-jin | ko |
| dc.contributor.author | Kim, Hyoung-joon | ko |
| dc.contributor.author | Lee, Ki-won | ko |
| dc.date.accessioned | 2022-12-26T03:00:13Z | - |
| dc.date.available | 2022-12-26T03:00:13Z | - |
| dc.identifier.uri | http://hdl.handle.net/10203/303683 | - |
| dc.description.abstract | The present invention is to provide a method for bonding between electrical devices, including the steps of: aligning electrodes on a bonded area of an upper electrical device and a lower electrical device to be bonded; and curing of adhesives by applying ultrasonic energy to the adhesives between the upper electrical device and the lower electrical device. | - |
| dc.title | Method for bonding between electrical devices using ultrasonic vibration | - |
| dc.title.alternative | 초음파진동을 이용한 전기기기의 접합방법 | - |
| dc.type | Patent | - |
| dc.type.rims | PAT | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Yim, Myung-jin | - |
| dc.contributor.nonIdAuthor | Kim, Hyoung-joon | - |
| dc.contributor.assignee | KAIST | - |
| dc.identifier.iprsType | 특허 | - |
| dc.identifier.patentApplicationNumber | 200680043828.9 | - |
| dc.identifier.patentRegistrationNumber | ZL200680043828.9 | - |
| dc.date.application | 2006-11-22 | - |
| dc.date.registration | 2011-04-20 | - |
| dc.publisher.country | CC | - |
- Appears in Collection
- MS-Patent(특허)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.