A Compact Multi-Bit Flip-Flop with Smaller Height Implementation and Metal-Less Intra-Cell Routing

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Multi-bit flip-flops (MBFFs) are widely used in modern circuit designs because of their lower power consumption and smaller footprint. However, conventional MBFFs have routability issues due to the dense intra-cell connections. Since many horizontal connections are populated in the typical MBFF layouts, metal-2 (M2) tracks are highly occupied inside the cell. Accordingly, routers cannot leverage the M2 tracks for inter-cell connections. The conventional MBFFs also show a limited impact on the cell area reduction. Since the cell area saving of an MBFF mainly comes from the clock driver sharing, the layouts of other flip-flop modules remain almost the same. In this paper, we propose a compact MBFF with metal-less clock routing and smaller height implementation. To achieve a sparse population of M2 routing tracks, we vertically place MBFF modules and interconnect them using the poly layer. As a result, the wire length of M2 layer inside a cell is significantly reduced. We also propose the smaller cell height implementation for compact MBFF layouts. Assuming the default standard cell height of 9 tracks, we present a 6-track MBFF implementation and the glue logic which makes legal cell placement with the 9-track logic cells. Experiments with a few test circuits show that the number of routing grids having congestion overflow is reduced by 16% and 73%, on average, compared to the single-bit flip-flop and conventional MBFF based designs, respectively. Total cell area is also reduced by 8% and 2%, on average, compared to the single-bit flip-flop and conventional MBFF based designs, respectively.
Publisher
SPIE-INT SOC OPTICAL ENGINEERING
Issue Date
2018-03
Language
English
Citation

Conference on Design-Process-Technology Co-Optimization for Manufacturability XII

ISSN
0277-786X
DOI
10.1117/12.2297519
URI
http://hdl.handle.net/10203/274871
Appears in Collection
EE-Conference Papers(학술회의논문)
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