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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Low Temperature Camera Module Assembly Using Acrylic-based Solder ACFs with Ultrasonic-Assisted Thermo-Compression Bonding Method

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Kim, Yoo-Sun / Kim, Seung-Ho / Paik, Kyung-Wookresearcher
Publisher
The 63rd Electronic Components and Technology Conference
Issue Date
2013-05-29
Language
English
Citation

The 63rd Electronic Components and Technology Conference, pp.1613 - 1616

DOI
10.1109/ECTC.2013.6575787
URI
http://hdl.handle.net/10203/258341
Appears in Collection
MS-Conference Papers(학술회의논문)
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